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d28a9689c9
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> |
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dwc3-exynos.h | ||
dwc3-omap.h | ||
exynos4_tmu.h | ||
fsa9480.h | ||
leds-renesas-tpu.h | ||
macb.h | ||
msm_serial_hs.h | ||
mv_usb.h | ||
ntc_thermistor.h | ||
pxa_sdhci.h | ||
s3c-hsudc.h | ||
tegra_usb.h | ||
uio_pruss.h |