Eduardo Valentin a8892d8389 thermal: thermal_core: allow binding with limits on bind_params ... When registering a thermal zone device using platform information via bind_params, the thermal framework will always perform the cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT). This patch changes the data structures so that it is possible to inform what are the desired limits for each trip point inside a bind_param. The way the binding is performed is also changed so that it uses the new data structure. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>		2013-09-03 09:10:24 -04:00
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cpu-cooling-api.txt	thermal: add generic cpufreq cooling implementation	2012-09-24 14:44:38 +08:00
exynos_thermal	Documentation: thermal: Explain the exynos thermal driver model	2013-08-13 09:52:04 -04:00
exynos_thermal_emulation	doc: fix misspellings with 'codespell' tool	2013-05-28 12:02:12 +02:00
intel_powerclamp.txt	PM: Introduce Intel PowerClamp Driver	2013-02-06 13:45:00 +08:00
nouveau_thermal	drm/nouveau/hwmon: s/fan0/fan1/	2013-02-20 16:00:25 +10:00
sysfs-api.txt	thermal: thermal_core: allow binding with limits on bind_params	2013-09-03 09:10:24 -04:00
x86_pkg_temperature_thermal	Thermal: Documentation for x86 package temperature thermal driver	2013-06-18 06:27:57 +08:00