mirror of
https://github.com/edk2-porting/linux-next.git
synced 2024-12-23 12:43:55 +08:00
3d71769014
Here are the changes for v3.4 merge window. It includes a new glue layer for Samsung's Exynos platform, a simplification of memory management on DWC3 driver by using dev_xxx functions, a few optimizations to IRQ handling by dropping memcpy() and using bitshifts, a fix for TI's OMAP5430 TX Fifo Allocation, two fixes on USB2 test mode implementation (one on debugfs and one on ep0), and several minor changes such as whitespace cleanups, simplification of a few parts of the code, decreasing a long delay to something a bit saner, dropping a header which was included twice and so on. The highlight on this merge is the support for Samsung's Exynos platform, increasing the number of different users for this driver to three. Note that Samsung Exynos glue layer will only compile on platforms which provide implementation for the clk API for now. Once Samsung supports pm_runtime, that limitation can be dropped from the Makefile. -----BEGIN PGP SIGNATURE----- Version: GnuPG v1.4.11 (GNU/Linux) iQIcBAABAgAGBQJPUJ2bAAoJEIaOsuA1yqREwOgP/2bG6rvPBMlGmXvvR40HNUXJ jXzkXcrTBrO172Fxl2P+mAgNFggMURrOdiyXwl7+2Ib0NM7sS9jwikuxos8DwuQv Ci0GgJtQySORIl5Sw29uB1W65aV2ieNBh/fN/52LwVOQYITt89GYK1DsRUWRN2V/ 0bw3OepckiAFN5gWRykIYIUXZs8DQa+L1qYc6fexZk7zZ+XrjdNba8RzGzsyUelD BB0eOj4E2Mda6Yp7kyiBRuTXVAUChNa5J0iCvXSnR8l2wppfXlmD2UD4Sfo/yxd5 q25/rm1e1A4iKcPjSkhzTayQKrLWEgCxZK69sZXlEPG9qhA3iMjWDNBvEy6cV4bc bFFjwXAObX+bm+QDYqcD66iUZTPzEW149W/e5B7+XGk09NcCs/wqoA1jEgCLEHnv 3rsG0RvsgtMdwmBYpO8zrhJPTFa6NAq9Qc4nLj3WefXP9Vkl5gpfneIcgYKB6x0q LHRQsLHBWl/hXClWAPflDJaGQqEt6hjkA3IqV03yTlMNuYxDNJy931J6Cz9a9Lu5 Gr2By/bHVcADmt8WzituQsnLvQIzLLGl0U0lKpdl24I52roqMkZVj7XaWDojLVSq HZnbk+c3PdEXVIDNCz1QnCY/QojEhKkeR23LP3YD8L9KxcOu8DNyL1RKdYqx3Cnv vrqerutPusT6kGvaRQIk =4Z2+ -----END PGP SIGNATURE----- Merge tag 'dwc3-for-v3.4' of git://git.kernel.org/pub/scm/linux/kernel/git/balbi/usb into usb-next usb: dwc3: changes for v3.4 merge window Here are the changes for v3.4 merge window. It includes a new glue layer for Samsung's Exynos platform, a simplification of memory management on DWC3 driver by using dev_xxx functions, a few optimizations to IRQ handling by dropping memcpy() and using bitshifts, a fix for TI's OMAP5430 TX Fifo Allocation, two fixes on USB2 test mode implementation (one on debugfs and one on ep0), and several minor changes such as whitespace cleanups, simplification of a few parts of the code, decreasing a long delay to something a bit saner, dropping a header which was included twice and so on. The highlight on this merge is the support for Samsung's Exynos platform, increasing the number of different users for this driver to three. Note that Samsung Exynos glue layer will only compile on platforms which provide implementation for the clk API for now. Once Samsung supports pm_runtime, that limitation can be dropped from the Makefile. Conflicts: drivers/usb/dwc3/gadget.c |
||
|---|---|---|
| .. | ||
| core.c | ||
| core.h | ||
| debug.h | ||
| debugfs.c | ||
| dwc3-exynos.c | ||
| dwc3-omap.c | ||
| dwc3-pci.c | ||
| ep0.c | ||
| gadget.c | ||
| gadget.h | ||
| host.c | ||
| io.h | ||
| Kconfig | ||
| Makefile | ||