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d28a9689c9
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>
25 lines
712 B
C
25 lines
712 B
C
/**
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* dwc3-exynos.h - Samsung EXYNOS DWC3 Specific Glue layer, header.
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*
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* Copyright (c) 2012 Samsung Electronics Co., Ltd.
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* http://www.samsung.com
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*
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* Author: Anton Tikhomirov <av.tikhomirov@samsung.com>
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*
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* This program is free software; you can redistribute it and/or modify
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* it under the terms of the GNU General Public License as published by
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* the Free Software Foundation; either version 2 of the License, or
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* (at your option) any later version.
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*/
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#ifndef _DWC3_EXYNOS_H_
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#define _DWC3_EXYNOS_H_
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struct dwc3_exynos_data {
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int phy_type;
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int (*phy_init)(struct platform_device *pdev, int type);
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int (*phy_exit)(struct platform_device *pdev, int type);
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};
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#endif /* _DWC3_EXYNOS_H_ */
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