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linux-next/drivers/iio/temperature
Lars-Peter Clausen 87ac0c24bd iio: tmp007: Fix name attribute ABI
The IIO ABI specifies the name field of the IIO device as:

	Description of the physical chip / device for device X.
	Typically a part number.

The tmp007 driver currently uses the name of the parent device instead.
Change this to the part name to be in accordance with the ABI.

Signed-off-by: Lars-Peter Clausen <lars@metafoo.de>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
2017-01-30 20:38:13 +00:00
..
Kconfig iio:temperature: Add support for TI TMP007 sensor 2017-01-14 10:45:05 +00:00
Makefile iio:temperature: Add support for TI TMP007 sensor 2017-01-14 10:45:05 +00:00
maxim_thermocouple.c Second round of new device support, cleanups and fixes for IIO in the 4.10 cycle 2016-11-07 09:14:03 +01:00
mlx90614.c iio: convert to common i2c_check_functionality() return value 2016-02-27 17:17:43 +00:00
tmp006.c iio: convert to common i2c_check_functionality() return value 2016-02-27 17:17:43 +00:00
tmp007.c iio: tmp007: Fix name attribute ABI 2017-01-30 20:38:13 +00:00
tsys01.c iio: convert to common i2c_check_functionality() return value 2016-02-27 17:17:43 +00:00
tsys02d.c iio: Export I2C module alias information 2016-05-21 20:08:14 +01:00