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0dd88793aa
In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
32 lines
1.1 KiB
Makefile
32 lines
1.1 KiB
Makefile
#
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# Makefile for sensor chip drivers.
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#
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obj-$(CONFIG_THERMAL) += thermal_sys.o
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thermal_sys-y += thermal_core.o
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# interface to/from other layers providing sensors
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thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o
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# governors
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thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o
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thermal_sys-$(CONFIG_THERMAL_GOV_STEP_WISE) += step_wise.o
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thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
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# cpufreq cooling
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thermal_sys-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
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# platform thermal drivers
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obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
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obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
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obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
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obj-y += samsung/
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obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
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obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
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obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
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obj-$(CONFIG_IMX_THERMAL) += imx_thermal.o
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obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
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obj-$(CONFIG_INTEL_POWERCLAMP) += intel_powerclamp.o
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obj-$(CONFIG_X86_PKG_TEMP_THERMAL) += x86_pkg_temp_thermal.o
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obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/
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