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thermal: ti-soc-thermal: add DT example for DRA752 chip

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Update documentation by adding an example for DRA752 on DT description.

Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This commit is contained in:
Eduardo Valentin 2013-05-29 15:07:46 +00:00 committed by Zhang Rui
parent 25870e6234
commit ca0c711463
1 changed files with 12 additions and 0 deletions
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12
Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
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@ -59,3 +59,15 @@ bandgap {
compatible = "ti,omap5430-bandgap";
interrupts = <0 126 4>; /* talert */
};
DRA752:
bandgap {
reg = <0x4a0021e0 0xc
0x4a00232c 0xc
0x4a002380 0x2c
0x4a0023C0 0x3c
0x4a002564 0x8
0x4a002574 0x50>;
compatible = "ti,dra752-bandgap";
interrupts = <0 126 4>; /* talert */
};