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linux-next/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt

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staging: OMAP4+: thermal: introduce bandgap temperature sensor In the System Control Module, OMAP supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. This patch provides a platform driver which expose this feature. It is moduled as a MFD child of the System Control Module core MFD driver. This driver provides only APIs to access the device properties, like temperature, thresholds and update rate. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: J Keerthy <j-keerthy@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-13 00:02:29 +08:00
* Texas Instrument OMAP SCM bandgap bindings
In the System Control Module, OMAP supplies a voltage reference
and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Required properties:
- compatible : Should be:
staging: omap-thermal: update DT entry documentation Simple update on documentation file for DT. This patch also adds an example for OMAP4430 and 0MAP4470, and also updated OMAP4460's example. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:34 +08:00
- "ti,omap4430-bandgap" : for OMAP4430 bandgap
- "ti,omap4460-bandgap" : for OMAP4460 bandgap
- "ti,omap4470-bandgap" : for OMAP4470 bandgap
- "ti,omap5430-bandgap" : for OMAP5430 bandgap
staging: OMAP4+: thermal: introduce bandgap temperature sensor In the System Control Module, OMAP supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. This patch provides a platform driver which expose this feature. It is moduled as a MFD child of the System Control Module core MFD driver. This driver provides only APIs to access the device properties, like temperature, thresholds and update rate. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: J Keerthy <j-keerthy@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-13 00:02:29 +08:00
- interrupts : this entry should indicate which interrupt line
the talert signal is routed to;
Specific:
thermal: ti-soc-thermal: use standard GPIO DT bindings This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-07 23:11:53 +08:00
- gpios : this entry should be used to inform which GPIO
line the tshut signal is routed to. The informed GPIO will
be treated as an IRQ;
staging: omap-thermal: update DT entry documentation Simple update on documentation file for DT. This patch also adds an example for OMAP4430 and 0MAP4470, and also updated OMAP4460's example. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:34 +08:00
- regs : this entry must also be specified and it is specific
to each bandgap version, because the mapping may change from
soc to soc, apart of depending on available features.
staging: OMAP4+: thermal: introduce bandgap temperature sensor In the System Control Module, OMAP supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. This patch provides a platform driver which expose this feature. It is moduled as a MFD child of the System Control Module core MFD driver. This driver provides only APIs to access the device properties, like temperature, thresholds and update rate. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: J Keerthy <j-keerthy@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-13 00:02:29 +08:00
Example:
staging: omap-thermal: update DT entry documentation Simple update on documentation file for DT. This patch also adds an example for OMAP4430 and 0MAP4470, and also updated OMAP4460's example. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:34 +08:00
OMAP4430:
bandgap {
reg = <0x4a002260 0x4 0x4a00232C 0x4>;
compatible = "ti,omap4430-bandgap";
};
OMAP4460:
bandgap {
reg = <0x4a002260 0x4
0x4a00232C 0x4
0x4a002378 0x18>;
compatible = "ti,omap4460-bandgap";
interrupts = <0 126 4>; /* talert */
thermal: ti-soc-thermal: use standard GPIO DT bindings This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-07 23:11:53 +08:00
gpios = <&gpio3 22 0>; /* tshut */
staging: omap-thermal: update DT entry documentation Simple update on documentation file for DT. This patch also adds an example for OMAP4430 and 0MAP4470, and also updated OMAP4460's example. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:34 +08:00
};
staging: OMAP4+: thermal: introduce bandgap temperature sensor In the System Control Module, OMAP supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. This patch provides a platform driver which expose this feature. It is moduled as a MFD child of the System Control Module core MFD driver. This driver provides only APIs to access the device properties, like temperature, thresholds and update rate. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: J Keerthy <j-keerthy@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-13 00:02:29 +08:00
staging: omap-thermal: update DT entry documentation Simple update on documentation file for DT. This patch also adds an example for OMAP4430 and 0MAP4470, and also updated OMAP4460's example. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:34 +08:00
OMAP4470:
staging: OMAP4+: thermal: introduce bandgap temperature sensor In the System Control Module, OMAP supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. This patch provides a platform driver which expose this feature. It is moduled as a MFD child of the System Control Module core MFD driver. This driver provides only APIs to access the device properties, like temperature, thresholds and update rate. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: J Keerthy <j-keerthy@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-13 00:02:29 +08:00
bandgap {
reg = <0x4a002260 0x4
0x4a00232C 0x4
0x4a002378 0x18>;
staging: omap-thermal: update DT entry documentation Simple update on documentation file for DT. This patch also adds an example for OMAP4430 and 0MAP4470, and also updated OMAP4460's example. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:34 +08:00
compatible = "ti,omap4470-bandgap";
staging: OMAP4+: thermal: introduce bandgap temperature sensor In the System Control Module, OMAP supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. This patch provides a platform driver which expose this feature. It is moduled as a MFD child of the System Control Module core MFD driver. This driver provides only APIs to access the device properties, like temperature, thresholds and update rate. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: J Keerthy <j-keerthy@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-13 00:02:29 +08:00
interrupts = <0 126 4>; /* talert */
thermal: ti-soc-thermal: use standard GPIO DT bindings This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-07 23:11:53 +08:00
gpios = <&gpio3 22 0>; /* tshut */
staging: OMAP4+: thermal: introduce bandgap temperature sensor In the System Control Module, OMAP supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. This patch provides a platform driver which expose this feature. It is moduled as a MFD child of the System Control Module core MFD driver. This driver provides only APIs to access the device properties, like temperature, thresholds and update rate. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: J Keerthy <j-keerthy@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-13 00:02:29 +08:00
};
staging: omap-thermal: add DT example for OMAP54xx devices Update documentation with DT example for OMAP54xx devices. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:35 +08:00
OMAP5430:
bandgap {
reg = <0x4a0021e0 0xc
0x4a00232c 0xc
0x4a002380 0x2c
0x4a0023C0 0x3c>;
compatible = "ti,omap5430-bandgap";
thermal: ti-soc-thermal: update DT reference for OMAP5430 Add missing irq line for TALERT on DT entry for OMAP5430. Cc: linux-pm@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-29 23:07:40 +08:00
interrupts = <0 126 4>; /* talert */
staging: omap-thermal: add DT example for OMAP54xx devices Update documentation with DT example for OMAP54xx devices. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-02-27 06:53:35 +08:00
};
thermal: ti-soc-thermal: add DT example for DRA752 chip Update documentation by adding an example for DRA752 on DT description. Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-29 23:07:46 +08:00
DRA752:
bandgap {
reg = <0x4a0021e0 0xc
0x4a00232c 0xc
0x4a002380 0x2c
0x4a0023C0 0x3c
0x4a002564 0x8
0x4a002574 0x50>;
compatible = "ti,dra752-bandgap";
interrupts = <0 126 4>; /* talert */
};
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