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This patch adds a basic support for AM574x Industrial Development Kit [1]. Use multi_v7_defconfig as kernel configuration file instead of the deprecated omap2plus_defconfig [2]. The main differences between upstream kernels and the TI vendor tree (5.10.x based) are: - pru based 100M ethernet ports will not work with upstream kernels since the prueth driver for AM57 is not upstream yet (as of 6.8-rc2) [3]. - The ARM/DSP examples provided by TI [4] will not work either since they requires an experimental patch [5] adding "remote-processor messaging sockets". - There is no support for the POWERVR GPU SGX544 that requires additional userpace vendor (closed source) libraries. [1] https://www.ti.com/tool/TMDSIDK574 [2] https://git.kernel.org/pub/scm/linux/kernel/git/stable/linux.git/commit/?id=cca9f6838bac3441a42fa906314bf5e3bff50ac5 [3] https://git.ti.com/cgit/ti-linux-kernel/ti-linux-kernel/commit/?id=792b57aac224416f66175c15d60379a4cf581d0f [4] https://git.ti.com/cgit/processor-sdk/big-data-ipc-examples [5] https://git.ti.com/cgit/ti-linux-kernel/ti-linux-kernel/commit/?id=f4b978a978c38149f712ddd137f12ed5fb914161 Signed-off-by: Romain Naour <romain.naour@smile.fr> Reviewed-by: Giulio Benetti <giulio.benetti@benettiengineering.com> Tested-by: Giulio Benetti <giulio.benetti@benettiengineering.com> Signed-off-by: Romain Naour <romain.naour@smile.fr> |
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| extlinux.conf | ||
| genimage.cfg | ||
| post-build.sh | ||
| readme.txt | ||
Texas Instuments AM574x IDK Test and Development Board
Description
===========
This configuration will build a basic image for the TI AM574x IDK
board: https://www.ti.com/tool/TMDSIDK574
How to build it
===============
Configure Buildroot:
$ make am574x_idk_defconfig
Compile everything and build the USB flash drive image:
$ make
How to write the SD card
========================
Once the build process is finished you will have an image called "sdcard.img"
in the output/images/ directory.
Copy the bootable "sdcard.img" onto an SD card with "dd":
$ sudo dd if=output/images/sdcard.img of=/dev/sdX