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d28a9689c9
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> |
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.. | ||
core.c | ||
core.h | ||
debug.h | ||
debugfs.c | ||
dwc3-exynos.c | ||
dwc3-omap.c | ||
dwc3-pci.c | ||
ep0.c | ||
gadget.c | ||
gadget.h | ||
host.c | ||
io.h | ||
Kconfig | ||
Makefile |