linux/Documentation/devicetree/bindings/vendor-prefixes.txt
Linus Torvalds 42daabf62b ARM SoC late changes
These are changes that arrived a little late before the merge
 window or that have multiple dependencies on previous branches
 so they did not fit into one of the earlier ones. There
 are 10 branches merged here, a total of 39 non-merge commits.
 Contents are a mixed bag for the above reasons:
 
 * Two new SoC platforms: ST microelectronics stixxxx and
   the TI 'Nspire' graphing calculator. These should have
   been in the 'soc' branch but were a little late
 * Support for the Exynos 5420 variant in mach-exynos,
   which is based on the other exynos branches to avoid
   conflicts.
 * Various small changes for sh-mobile, ux500 and davinci
 * Common clk support for MSM
 
 Conflicts:
 * In Kconfig.debug, various additions trivially conflict,
   the list should be kept in alphabetical order when
   resolving.
 -----BEGIN PGP SIGNATURE-----
 Version: GnuPG v1.4.12 (GNU/Linux)
 
 iQIVAwUAUdLnl2CrR//JCVInAQIrKhAAwvtsGNe6j9nDuLEitWtQAmhHYZQyUJ8k
 o9j/1j1CqhE8C0bLRud8D4m1GxfxbGeRm2d0HoNbxda3FmntUufqBDi6neMiQiLO
 VltC5rOYL8Mday0Asc3SBfjBj8SZC2bypicKy5zUfzsObCBt343g1WvYffMDNmwH
 FveOQK6q2BKmO67cazc9tk5xmxjVwP/LB8r5mQtiXmMguw0R+ZIDDIP6xaURFkxX
 SAElleD2wtvpVHP1d6AKHpXN99u3xV3uoJjKljECEXdBzW/ZX8m7FG2tKY5xy368
 ta0Nhh2MSRnBhUYOH9uah4PQWYEsbZ+M/W+3J9tKRu6q9D/c/AAxILyXUY2tcHNC
 o1UwcUn1druirx3X1AW8HYAGNwW7BD3HANzIiUkQZG7ByfM4qCtUEo2SAFNIGBoR
 v1FMLhMPgMWotZnKrDQQd0anxkKIOFaSMRVgpQLW2jQt/B7sHLmEH2yDffkbSD76
 PQDThnW/dfm9dgeK+X4fPrveIMKbjQlbFz0okN+LPsUf8e1045HBgCi2A0lTIGWM
 kVVgXHKKXi8G8HBa4VyDlORVHXk1bJEheF+zlDvdk4fHkcf+H/OfvFG2O9TdIdpb
 ITXRyyteaRM4YIZpnJbzeeZDZXT89c2ah7xq36iM+L1ScidyntPquViXeasSc8r6
 pKu9ZDc0Mow=
 =cRu2
 -----END PGP SIGNATURE-----

Merge tag 'late-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc

Pull ARM SoC late changes from Arnd Bergmann:
 "These are changes that arrived a little late before the merge window
  or that have multiple dependencies on previous branches so they did
  not fit into one of the earlier ones.  There are 10 branches merged
  here, a total of 39 non-merge commits.  Contents are a mixed bag for
  the above reasons:

   * Two new SoC platforms: ST microelectronics stixxxx and the TI
     'Nspire' graphing calculator.  These should have been in the 'soc'
     branch but were a little late
   * Support for the Exynos 5420 variant in mach-exynos, which is based
     on the other exynos branches to avoid conflicts.
   * Various small changes for sh-mobile, ux500 and davinci
   * Common clk support for MSM"

* tag 'late-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (39 commits)
  ARM: ux500: bail out on alien cpus
  ARM: davinci: da850: adopt to pinctrl-single change for configuring multiple pins
  serial: sh-sci: Initialise variables before access in sci_set_termios()
  ARM: stih41x: Add B2020 board support
  ARM: stih41x: Add B2000 board support
  ARM: sti: Add DEBUG_LL console support
  ARM: sti: Add STiH416 SOC support
  ARM: sti: Add STiH415 SOC support
  ARM: msm: Migrate to common clock framework
  ARM: msm: Make proc_comm clock control into a platform driver
  ARM: msm: Prepare clk_get() users in mach-msm for clock-pcom driver
  ARM: msm: Remove clock-7x30.h include file
  ARM: msm: Remove custom clk_set_{max,min}_rate() API
  ARM: msm: Remove custom clk_set_flags() API
  msm: iommu: Use clk_set_rate() instead of clk_set_min_rate()
  msm: iommu: Convert to clk_prepare/unprepare
  msm_sdcc: Convert to clk_prepare/unprepare
  usb: otg: msm: Convert to clk_prepare/unprepare
  msm_serial: Use devm_clk_get() and properly return errors
  msm_serial: Convert to clk_prepare/unprepare
  ...
2013-07-02 14:42:51 -07:00

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Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
ad Avionic Design GmbH
adi Analog Devices, Inc.
aeroflexgaisler Aeroflex Gaisler AB
ak Asahi Kasei Corp.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
apm Applied Micro Circuits Corporation (APM)
arm ARM Ltd.
atmel Atmel Corporation
bosch Bosch Sensortec GmbH
brcm Broadcom Corporation
cavium Cavium, Inc.
chrp Common Hardware Reference Platform
cirrus Cirrus Logic, Inc.
cortina Cortina Systems, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
denx Denx Software Engineering
emmicro EM Microelectronic
epson Seiko Epson Corp.
est ESTeem Wireless Modems
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
hp Hewlett Packard
ibm International Business Machines (IBM)
idt Integrated Device Technologies, Inc.
img Imagination Technologies Ltd.
intercontrol Inter Control Group
linux Linux-specific binding
lsi LSI Corp. (LSI Logic)
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
mosaixtech Mosaix Technologies, Inc.
national National Semiconductor
nintendo Nintendo
nvidia NVIDIA
nxp NXP Semiconductors
onnn ON Semiconductor Corp.
picochip Picochip Ltd
powervr PowerVR (deprecated, use img)
qcom Qualcomm, Inc.
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
samsung Samsung Semiconductor
sbs Smart Battery System
schindler Schindler
sil Silicon Image
silabs Silicon Laboratories
simtek
sirf SiRF Technology, Inc.
snps Synopsys, Inc.
st STMicroelectronics
ste ST-Ericsson
stericsson ST-Ericsson
ti Texas Instruments
toshiba Toshiba Corporation
v3 V3 Semiconductor
via VIA Technologies, Inc.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
winbond Winbond Electronics corp.
xlnx Xilinx