linux/include/uapi
Linus Torvalds 583f2bcf86 - Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
 
 - Add the missing fifth node on the rcar_gen3 sensor (Niklas
   Söderlund)
 
 - Remove duplicate include in ti-bandgap (Zhang Yunkai)
 
 - Assign error code in the error path in the function
   thermal_of_populate_bind_params() (Jia-Ju Bai)
 
 - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
   King)
 
 - Use the device name instead of auto-numbering for a better
   identification of the cooling device (Daniel Lezcano)
 
 - Improve a bit the division accuracy in the power allocator governor
   (Jeson Gao)
 
 - Enable the missing third sensor on msm8976 (Konrad Dybcio)
 
 - Add QCom tsens driver co-maintainer (Thara Gopinath)
 
 - Fix memory leak and use after free errors in the core code (Daniel
   Lezcano)
 
 - Add the MDM9607 compatible bindings (Konrad Dybcio)
 
 - Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
 
 - Fix negative index array access when converting the frequency to
   power in the energy model (Brian-sy Yang)
 
 - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
 
 - Update maintainer file for CPU cooling device section (Lukasz Luba)
 
 - Fix missing put_device on error in the Qcom tsens driver (Guangqing
   Zhu)
 
 - Add compatible DT binding for sm8350 (Robert Foss)
 
 - Add support for the MDM9607's tsens driver (Konrad Dybcio)
 
 - Remove duplicate error messages in thermal_mmio and the bcm2835
   driver (Ruiqi Gong)
 
 - Add the Thermal Temperature Cooling driver (Zhang Rui)
 
 - Remove duplicate error messages in the Hisilicon sensor driver (Ye
   Bin)
 
 - Use the devm_platform_ioremap_resource_byname() function instead of
   a couple of corresponding calls (dingsenjie)
 
 - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
 
 - Add missing property in the DT thermal sensor binding (Rafał
   Miłecki)
 
 - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
 
 - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
 
 - Replace the thermal_notify_framework() call by a call to the
   thermal_zone_device_update() function. Remove the function as well
   as the corresponding documentation (Thara Gopinath)
 
 - Add support for the ipq8064-tsens sensor along with a set of
   cleanups and code preparation (Ansuel Smith)
 
 - Add a lockless __thermal_cdev_update() function to improve the
   locking scheme in the core code and governors (Lukasz Luba)
 
 - Fix multiple cooling device notification changes (Lukasz Luba)
 
 - Remove unneeded variable initialization (Colin Ian King)
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Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal updates from Daniel Lezcano:

 - Remove duplicate error message for the amlogic driver (Tang Bin)

 - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)

 - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)

 - Remove duplicate include in ti-bandgap (Zhang Yunkai)

 - Assign error code in the error path in the function
   thermal_of_populate_bind_params() (Jia-Ju Bai)

 - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
   King)

 - Use the device name instead of auto-numbering for a better
   identification of the cooling device (Daniel Lezcano)

 - Improve a bit the division accuracy in the power allocator governor
   (Jeson Gao)

 - Enable the missing third sensor on msm8976 (Konrad Dybcio)

 - Add QCom tsens driver co-maintainer (Thara Gopinath)

 - Fix memory leak and use after free errors in the core code (Daniel
   Lezcano)

 - Add the MDM9607 compatible bindings (Konrad Dybcio)

 - Fix trivial spello in the copyright name for Hisilicon (Hao Fang)

 - Fix negative index array access when converting the frequency to
   power in the energy model (Brian-sy Yang)

 - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)

 - Update maintainer file for CPU cooling device section (Lukasz Luba)

 - Fix missing put_device on error in the Qcom tsens driver (Guangqing
   Zhu)

 - Add compatible DT binding for sm8350 (Robert Foss)

 - Add support for the MDM9607's tsens driver (Konrad Dybcio)

 - Remove duplicate error messages in thermal_mmio and the bcm2835
   driver (Ruiqi Gong)

 - Add the Thermal Temperature Cooling driver (Zhang Rui)

 - Remove duplicate error messages in the Hisilicon sensor driver (Ye
   Bin)

 - Use the devm_platform_ioremap_resource_byname() function instead of a
   couple of corresponding calls (dingsenjie)

 - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)

 - Add missing property in the DT thermal sensor binding (Rafał Miłecki)

 - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)

 - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)

 - Replace the thermal_notify_framework() call by a call to the
   thermal_zone_device_update() function. Remove the function as well as
   the corresponding documentation (Thara Gopinath)

 - Add support for the ipq8064-tsens sensor along with a set of cleanups
   and code preparation (Ansuel Smith)

 - Add a lockless __thermal_cdev_update() function to improve the
   locking scheme in the core code and governors (Lukasz Luba)

 - Fix multiple cooling device notification changes (Lukasz Luba)

 - Remove unneeded variable initialization (Colin Ian King)

* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
  thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
  thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
  thermal/core/fair share: Use the lockless __thermal_cdev_update() function
  thermal/core/fair share: Lock the thermal zone while looping over instances
  thermal/core/power_allocator: Update once cooling devices when temp is low
  thermal/core/power_allocator: Maintain the device statistics from going stale
  thermal/core: Create a helper __thermal_cdev_update() without a lock
  dt-bindings: thermal: tsens: Document ipq8064 bindings
  thermal/drivers/tsens: Add support for ipq8064-tsens
  thermal/drivers/tsens: Drop unused define for msm8960
  thermal/drivers/tsens: Replace custom 8960 apis with generic apis
  thermal/drivers/tsens: Fix bug in sensor enable for msm8960
  thermal/drivers/tsens: Use init_common for msm8960
  thermal/drivers/tsens: Add VER_0 tsens version
  thermal/drivers/tsens: Convert msm8960 to reg_field
  thermal/drivers/tsens: Don't hardcode sensor slope
  Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
  thermal/core: Remove thermal_notify_framework
  iwlwifi: mvm: tt: Replace thermal_notify_framework
  dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
  ...
2021-05-05 12:46:48 -07:00
..
asm-generic Add Landlock, a new LSM from Mickaël Salaün <mic@linux.microsoft.com> 2021-05-01 18:50:44 -07:00
drm Merge tag 'drm-msm-next-2021-04-11' of https://gitlab.freedesktop.org/drm/msm into drm-next 2021-04-13 23:35:54 +02:00
linux - Remove duplicate error message for the amlogic driver (Tang Bin) 2021-05-05 12:46:48 -07:00
misc Char/Misc driver updates for 5.13-rc1 2021-04-26 11:03:17 -07:00
mtd mtd: add OTP (one-time-programmable) erase ioctl 2021-03-28 19:24:54 +02:00
rdma RDMA/nldev: Add copy-on-fork attribute to get sys command 2021-04-27 15:33:20 -03:00
scsi scsi: fc: Update formal FPIN descriptor definitions 2020-10-26 18:06:45 -04:00
sound Auxiliary Bus support tag for 5.11-rc1 2020-12-04 20:39:45 +00:00
video
xen xen/gntdev: gntdev.h: drop a duplicated word 2020-08-03 07:46:42 +02:00
Kbuild