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cb84b19474
This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com> |
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