Chanwoo Choi 1fe56dc16a thermal: samsung: Add TMU support for Exynos3250 SoC ... This patch add registers, bit fields and compatible strings for Exynos3250 TMU (Thermal Management Unit). Exynos3250 uses the Cortex-A7 dual cores and has a target speed of 1.0 GHz. Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com> [Add MUX address setting bits by Jonghwa Lee] Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kyungmin Park <kyungmin.park@samsung.com> Reviewed-by: Amit Daniel Kachhap<amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>		2014-07-15 22:58:44 +08:00
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samsung	thermal: samsung: Add TMU support for Exynos3250 SoC	2014-07-15 22:58:44 +08:00
ti-soc-thermal	thermal: ti-soc-thermal: ti-bandgap.c: Cleaning up wrong address is checked	2014-07-01 09:52:35 +08:00
armada_thermal.c	thermal: armada: Support Armada 380 SoC	2014-05-15 17:12:49 +08:00
cpu_cooling.c	thermal: cpu_cooling: Use cpufreq_for_each_valid_entry macro for iteration	2014-04-30 00:06:49 +02:00
db8500_cpufreq_cooling.c	thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL()	2013-04-27 09:28:38 +08:00
db8500_thermal.c	thermal: db8500: Fix missing mutex_unlock() in probe error paths	2013-03-26 22:08:08 +08:00
dove_thermal.c	Merge branches 'misc', 'drv_cleanup', 'devm-cleanup' and 'ti-soc' of .git into next	2013-05-28 10:46:46 +08:00
fair_share.c	Thermal: build thermal governors into thermal_sys module	2013-04-14 23:28:43 +08:00
imx_thermal.c	Thermal: imx: correct critical trip temperature setting	2014-07-01 09:22:28 +08:00
int3403_thermal.c	Thermal/int3403: Fix thermal hysteresis unit conversion	2014-05-15 16:38:48 +08:00
intel_powerclamp.c	thermal/intel_powerclamp: add newer cpu ids	2014-05-15 17:02:18 +08:00
intel_soc_dts_thermal.c	thermal: Intel SoC DTS thermal	2014-05-15 16:37:24 +08:00
Kconfig	Merge branches 'armada-375-380-soc-support', 'eduardo-thermal-soc-fixes', 'intel-soc-dts-thermal' and 'thermal-soc-fixes' of .git into next	2014-05-15 17:18:02 +08:00
kirkwood_thermal.c	Merge branches 'misc', 'drv_cleanup', 'devm-cleanup' and 'ti-soc' of .git into next	2013-05-28 10:46:46 +08:00
Makefile	thermal: Intel SoC DTS thermal	2014-05-15 16:37:24 +08:00
of-thermal.c	thermal: Bind cooling devices with the correct arguments	2014-06-30 10:20:27 +08:00
rcar_thermal.c	thermal: rcar: remove unnecessary OOM messages	2014-05-15 17:15:26 +08:00
spear_thermal.c	thermal: spear: remove unnecessary OOM messages	2014-05-15 17:15:26 +08:00
step_wise.c	thermal: debug: add debug statement for core and step_wise	2014-01-02 10:52:48 +08:00
thermal_core.c	Thermal: thermal zone governor fix	2014-03-03 23:15:57 +08:00
thermal_core.h	thermal: introduce device tree parser	2013-12-04 09:31:34 -04:00
thermal_hwmon.c	thermal: hwmon: Make the check for critical temp valid consistent	2014-06-30 10:17:27 +08:00
thermal_hwmon.h	thermal: hwmon: move hwmon support to single file	2013-09-03 09:09:12 -04:00
user_space.c	Thermal: build thermal governors into thermal_sys module	2013-04-14 23:28:43 +08:00
x86_pkg_temp_thermal.c	thermal, x86-pkg-temp: Fix CPU hotplug callback registration	2014-03-20 13:43:47 +01:00