The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.
To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().
Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The registers are differently named and at different offsets, but their
functionality is the same as for Gen3.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com
Gen4 will be very different, so refactor Gen3 access into separate call
first.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com
More items to describe the TSCs are needed soon, so encapsulate the
current 'ths_tj_1' item into a struct.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com
R-Car H3 ES1.* was only available to an internal development group and
needed a lot of quirks and workarounds. These become a maintenance
burden now, so our development group decided to remove upstream support
and disable booting for this SoC. Public users only have ES2 onwards.
Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.
The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.
Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.
Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.
Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.
According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal core framework allows to get the number of thermal trips,
use it instead of visiting the thermal core structure internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20221003092602.1323944-16-daniel.lezcano@linaro.org
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Tested-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20220804224349.1926752-18-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang).
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control
driver (Rafael Wysocki).
-----BEGIN PGP SIGNATURE-----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=wj9M
-----END PGP SIGNATURE-----
Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These start a rework of the handling of trip points in the thermal
core, improve the cpufreq/devfreq cooling device handling, update some
thermal control drivers and the tmon utility and clean up code.
Specifics:
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to
be used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3
(Wolfram Sang).
- Convert the QCom tsens DT binding to the dtsformat format
(Krzysztof Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
control driver (Rafael Wysocki)"
* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
When setting up a new board, a plain "Can't register thermal zone"
didn't help me much because the thermal zones in DT were all fine. I
just had a sensor entry too much in the parent TSC node. Reword the
failure/success messages to contain the sensor number to make it easier
to understand which sensor is affected. Example output now:
rcar_gen3_thermal e6198000.thermal: Sensor 0: Loaded 1 trip points
rcar_gen3_thermal e6198000.thermal: Sensor 1: Loaded 1 trip points
rcar_gen3_thermal e6198000.thermal: Sensor 2: Loaded 1 trip points
rcar_gen3_thermal e6198000.thermal: Sensor 3: Can't register thermal zone
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20220610200500.6727-1-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
In production hardware the calibration values used to convert register
values to temperatures can be read from hardware. While pre-production
hardware still depends on pseudo values hard-coded in the driver.
Add support for reading out calibration values from hardware if it's
fused. The presence of fused calibration is indicated in the THSCP
register.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20211014103816.1939782-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Prepare for reading the THCODE and PTAT values from hardware fuses by
storing the values used during calculations in the drivers private
data structures.
As the values are now stored directly in the private data structures
there is no need to keep track of the TSC channel id as its only usage
was to lookup the THCODE row, drop it.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20211014103816.1939782-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The TSC id and number of TSC ids should be stored as unsigned int as
they can't be negative. Fix the datatype of the loop counter 'i' and
rcar_gen3_thermal_tsc.id to reflect this.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210804091818.2196806-3-niklas.soderlund+renesas@ragnatech.se
All supported hardware except V3U is capable of generating interrupts
to the CPU when the temperature go below or above a set value. Use this
to implement support for the set_trip() feature of the thermal core on
supported hardware.
The V3U have its interrupts routed to the ECM module and therefore can
not be used to implement set_trip() as the driver can't be made aware of
when the interrupt triggers.
Each TSC is capable of tracking up-to three different temperatures while
only two are needed to implement the tracking of the thermal window.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210804091818.2196806-2-niklas.soderlund+renesas@ragnatech.se
With -Wshadow:
drivers/thermal/rcar_gen3_thermal.c: In function ‘rcar_gen3_thermal_probe’:
drivers/thermal/rcar_gen3_thermal.c:310:13: warning: declaration of ‘rcar_gen3_ths_tj_1’ shadows a global declaration [-Wshadow]
310 | const int *rcar_gen3_ths_tj_1 = of_device_get_match_data(dev);
| ^~~~~~~~~~~~~~~~~~
drivers/thermal/rcar_gen3_thermal.c:246:18: note: shadowed declaration is here
246 | static const int rcar_gen3_ths_tj_1 = 126;
| ^~~~~~~~~~~~~~~~~~
To add to the confusion, the local variable has a different type.
Fix the shadowing by renaming the local variable to ths_tj_1.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/9ea7e65d0331daba96f9a7925cb3d12d2170efb1.1623076804.git.geert+renesas@glider.be
The fixed value of 157 used in the calculations are only correct for
M3-W, on other Gen3 SoC it should be 167. The constant can be derived
correctly from the static TJ_3 constant and the SoC specific TJ_1 value.
Update the calculation be correct on all Gen3 SoCs.
Fixes: 4eb39f79ef ("thermal: rcar_gen3_thermal: Update value of Tj_1")
Reported-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210605085211.564909-1-niklas.soderlund+renesas@ragnatech.se
Add support for up to five TSC nodes. The new THCODE values are taken
from the example in the datasheet.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210309162419.2621359-1-niklas.soderlund+renesas@ragnatech.se
Remove the usage of interrupts for the normal temperature operation and
depend on the polling performed by the thermal core. This is done to
prepare to use the interrupts as they are intended to trigger once
specific trip points are passed and not to react to temperature changes
in the normal operational range.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201126220923.3107213-1-niklas.soderlund+renesas@ragnatech.se
drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events, temperature
and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
-----BEGIN PGP SIGNATURE-----
iQEzBAABCAAdFiEEGn3N4YVz0WNVyHskqDIjiipP6E8FAl8q7tsACgkQqDIjiipP
6E+5Rwf7BFEn5YXPvng8cmnAlgvEBc9DdT6mGSo0NpFm9MdUxXlaqvw3WWSGyqWQ
+z0Ka7lmn5XyiMsVN11++Snp+79X17HzZf9SXO3glyIpAn+5prTDRhzzj0/jPrtS
sEeI++DrILsKKMGVljzftLmwNJN9DkUDNcnmWmZdCDbYVEKtP9Pjf2wBjAnXj7sX
JA3CkHRMwYLEQbfaKz37M11cYM+LqbDOlb6U11YWgAGGJ7d7zNYRf2/YSYPM4AN6
iE6j0E+3jIlXesULsap1AzeJaBq+wFxj1FL2TUZ8KscvRrm3AucqzNAT2M/Bc5Az
XLKKzc6Gp9JfqB5KXhX2EDu7VRnDBg==
=cSMN
-----END PGP SIGNATURE-----
Merge tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add support to enable/disable the thermal zones resulting on core
code and drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events,
temperature and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian
Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz
Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
* tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (40 commits)
thermal: intel: intel_pch_thermal: Add Cannon Lake Low Power PCH support
thermal: mediatek: Add tsensor support for V2 thermal system
thermal: mediatek: Prepare to add support for other platforms
thermal: Update power allocator and devfreq cooling to SPDX licensing
MAINTAINERS: update entry to thermal governors file name prefixing
thermal: core: Add thermal zone enable/disable notification
thermal: qcom: tsens-v0_1: Add support for MSM8939
dt-bindings: tsens: qcom: Document MSM8939 compatible
thermal: core: Fix thermal zone lookup by ID
thermal: int340x: processor_thermal: fix: update Jasper Lake PCI id
thermal: imx8mm: Support module autoloading
thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor()
MAINTAINERS: Add maintenance information for IPA
thermal: rcar_gen3_thermal: Do not shadow thcode variable
dt-bindings: thermal: Get rid of thermal.txt and replace references
thermal: core: Move initialization after core initcall
thermal: netlink: Improve the initcall ordering
net: genetlink: Move initialization to core_initcall
thermal: rcar_gen3_thermal: Add r8a774e1 support
thermal/drivers/clock_cooling: Remove clock_cooling code
...
The function rcar_gen3_thermal_calc_coefs() takes an argument called
'thcode' which shadows the static global 'thcode' variable. This is not
harmful but bad for readability and is harmful for planned changes to
the driver. The THCODE values should be read from hardware fuses if they
are available and only fallback to the global 'thcode' variable if they
are not fused.
Rename the global 'thcode' variable to 'thcodes' to avoid shadowing the
symbol in functions that take it as an argument.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200610003300.884258-1-niklas.soderlund+renesas@ragnatech.se
As description for DIV_ROUND_CLOSEST in file include/linux/kernel.h.
"Result is undefined for negative divisors if the dividend variable
type is unsigned and for negative dividends if the divisor variable
type is unsigned."
In current code, the FIXPT_DIV uses DIV_ROUND_CLOSEST but has not
checked sign of divisor before using. It makes undefined temperature
value in case the value is negative.
This patch fixes to satisfy DIV_ROUND_CLOSEST description
and fix bug too. Note that the variable name "reg" is not good
because it should be the same type as rcar_gen3_thermal_read().
However, it's better to rename the "reg" in a further patch as
cleanup.
Signed-off-by: Van Do <van.do.xw@renesas.com>
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
[shimoda: minor fixes, add Fixes tag]
Fixes: 564e73d283 ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1593085099-2057-1-git-send-email-yoshihiro.shimoda.uh@renesas.com
Add support for the Thermal Sensor/Chip Internal Voltage Monitor in the
R-Car M3-W+ (R8A77961) SoC.
According to the R-Car Gen3 Hardware Manual Errata for Revision 2.00 of
Jan 31, 2020, the thermal parameters for R-Car M3-W+ are the same as for
R-Car M3-W.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200306105503.24267-3-geert+renesas@glider.be
The desired behavior of the driver is to generate an interrupt and call
thermal_zone_device_update() as soon as the temperature have changed
more then one degree.
When the set_trips operation was implemented it was believed that the
trip window set by the framework would move around the current
temperature and the hysteresis value described in devicetree. The
behavior of the framework is however to set a window based on the trip
points described in devicetree.
Remove the set_trips operation which was not used correctly and update
the temperatures that triggers interrupts directly from the interrupt
handler.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200212224917.737314-1-niklas.soderlund+renesas@ragnatech.se
When devm_add_action() was turned into devm_add_action_or_reset() the
curly brackets for the error case where kept but are not needed, remove
them to match the style of the driver.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200212224732.736785-1-niklas.soderlund+renesas@ragnatech.se
The hardware manual states that the operation of the sensor is not
guaranteed with temperatures above 125°C, not that the readings are
invalid. Remove the bound check and try to deliver temperature readings
even if we are outside the guaranteed operation range.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200117160554.3812787-3-niklas.soderlund+renesas@ragnatech.se
devm_add_action_or_reset() is introduced as a helper function which
internally calls devm_add_action(). If devm_add_action() fails
then it will execute the action mentioned and return the error code.
This reduce source code size (avoid writing the action twice)
and reduce the likelyhood of bugs.
Signed-off-by: Fuqian Huang <huangfq.daxian@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Update the formula to calculate temperature:
Currently, current TEMP is calculated as
average of val1 (is calculated by formula 1)
and val2 (is calculated by formula 2). But,
as description in HWM (chapter 10A.3.1.2 Normal Mode.)
If (TEMP_CODE < THCODE2[11:0]) CTEMP value should be val1.
If (TEMP_CODE > THCODE2[11:0]) CTEMP value should be val2.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Update the formula to calculate CTEMP:
Currently, the CTEMP is average of val1 (is calculated by
formula 1) and val2 (is calculated by formula 2). But,
as description in HWM (chapter 10A.3.1.1 Setting of Normal Mode)
If (STEMP < Tj_T) CTEMP value should be val1.
If (STEMP > Tj_T) CTEMP value should be val2.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
As evaluation of hardware team, temperature calculation formula
of M3-W is difference from all other SoCs as below:
- M3-W: Tj_1: 116 (so Tj_1 - Tj_3 = 157)
- Others: Tj_1: 126 (so Tj_1 - Tj_3 = 167)
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently after store trip points number in 'ret', it is overwritten
afterwards, this cause incorrect trip point number always be shown in
the debug information after register of each thermal zone.
This patch fix this issue by moving get of trip number to
end of thermal zone registration.
Fixes: 6269e9f790 ("thermal: rcar_gen3_thermal: Register hwmon sysfs interface")
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently IRQ remains enabled after .remove, later if device is probed,
IRQ is requested before .thermal_init, this may cause IRQ function be
called before device is initialized.
this patch disables interrupt in .remove, to ensure irq function
only be called after device is fully initialized.
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently IRQF_SHARED type interrupt line is allocated, but it
is not appropriate, as the interrupt line isn't shared between
different devices, instead IRQF_ONESHOT is the proper type.
By changing interrupt type to IRQF_ONESHOT, now irq handler is
no longer needed, as clear of interrupt status can be done in
threaded interrupt context.
Because IRQF_ONESHOT type interrupt line is kept disabled until
the threaded handler has been run, so there is no need to protect
read/write of REG_GEN3_IRQSTR with lock.
Fixes: 7d4b269776 ("enable hardware interrupts for trip points")
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Fix setting value for IRQCTL register. We are setting the last 6 bits
of (IRQCTL) to be 1 (0x3f), this is only suitable for H3ES1.*, according
to Hardware manual values 1 are "setting prohibited" for Gen3.
Signed-off-by: Hoan Nguyen An <na-hoan@jinso.co.jp>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Register the hwmon sysfs interface on R-Car Gen3 thermal driver to
align it with Gen2 driver. Use devm_add_action() to unregister the
hwmon interface automatically.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Wolfram Sang <wsa+renesas@sang-engineering.com>
Cc: linux-renesas-soc@vger.kernel.org
To: linux-pm@vger.kernel.org
From: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal SoC updates from Eduardo Valentin:
"Several new things coming up. Specifics:
- Rework of tsens and hisi thermal drivers
- OF-thermal now allows sharing multiple cooling devices on maps
- Added support for r8a7744 and R8A77970 on rcar thermal driver
- Added support for r8a774a1 on rcar_gen3 thermal driver
- New thermal driver stm32
- Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada,
qcom-spmi, rcar, da9062/61"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits)
thermal: da9062/61: Prevent hardware access during system suspend
thermal: rcar_thermal: Prevent doing work after unbind
thermal: rcar_thermal: Prevent hardware access during system suspend
thermal: rcar_gen3_thermal: add R8A77980 support
dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings
thermal: add stm32 thermal driver
dt-bindings: stm32-thermal: add binding documentation
thermal: rcar_thermal: add R8A77970 support
dt-bindings: thermal: rcar-thermal: document R8A77970 bindings
thermal: rcar_thermal: fix duplicate IRQ request
dt-bindings: thermal: rcar: Add device tree support for r8a7744
thermal/drivers/hisi: Add the dual clusters sensors for hi3660
thermal/drivers/hisi: Add more sensors channel
thermal/drivers/hisi: Remove pointless irq field
thermal/drivers/hisi: Use platform_get_irq_byname
thermal/drivers/hisi: Replace macro name with relevant sensor location
thermal/drivers/hisi: Add multiple sensors support
thermal/drivers/hisi: Prepare to support multiple sensors
thermal/drivers/hisi: Factor out the probe functions
thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer
...
Add the R-Car V3H (R8A77980) SoC support to the R-Car gen3 thermal driver.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
