Commit Graph

253 Commits

Author SHA1 Message Date
Zhang Rui
ded2d383b1 thermal/core: Remove thermal_bind_params structure
Remove struct thermal_bind_params because no one is using it for thermal
binding now.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330104526.3196-1-rui.zhang@intel.com
2023-04-07 11:18:22 +02:00
Rafael J. Wysocki
75f74a9071 - Add more thermal zone device encapsulation: prevent setting
structure field directly, access the sensor device instead the
   thermal zone's device for trace, relocate the traces in
   drivers/thermal (Daniel Lezcano)
 
 - Use the generic trip point for the i.MX and remove the get_trip_temp
   ops (Daniel Lezcano)
 
 - Use the devm_platform_ioremap_resource() in the Hisilicon driver
   (Yang Li)
 
 - Remove R-Car H3 ES1.* handling as public has only access to the ES2
   version and the upstream support for the ES1 has been shutdown (Wolfram Sang)
 
 - Add a delay after initializing the bank in order to let the time to
   the hardware to initialze itself before reading the temperature
   (Amjad Ouled-Ameur)
 
 - Add MT8365 support (Amjad Ouled-Ameur)
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Merge tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal control material for 6.4-rc1 from Daniel Lezcano:

"- Add more thermal zone device encapsulation: prevent setting
   structure field directly, access the sensor device instead the
   thermal zone's device for trace, relocate the traces in
   drivers/thermal (Daniel Lezcano)

 - Use the generic trip point for the i.MX and remove the get_trip_temp
   ops (Daniel Lezcano)

 - Use the devm_platform_ioremap_resource() in the Hisilicon driver
   (Yang Li)

 - Remove R-Car H3 ES1.* handling as public has only access to the ES2
   version and the upstream support for the ES1 has been shutdown (Wolfram
   Sang)

 - Add a delay after initializing the bank in order to let the time to
   the hardware to initialze itself before reading the temperature
   (Amjad Ouled-Ameur)

 - Add MT8365 support (Amjad Ouled-Ameur)"

* tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
  thermal/drivers/ti: Use fixed update interval
  thermal/drivers/stm: Don't set no_hwmon to false
  thermal/drivers/db8500: Use driver dev instead of tz->device
  thermal/core: Relocate the traces definition in thermal directory
  thermal/drivers/hisi: Use devm_platform_ioremap_resource()
  thermal/drivers/imx: Use the thermal framework for the trip point
  thermal/drivers/imx: Remove get_trip_temp ops
  thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling
  thermal/drivers/mediatek: Add delay after thermal banks initialization
  thermal/drivers/mediatek: Add support for MT8365 SoC
  thermal/drivers/mediatek: Control buffer enablement tweaks
  dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC
2023-04-03 20:43:32 +02:00
Rafael J. Wysocki
cd246fa969 thermal: core: Clean up thermal_list_lock locking
Once thermal_list_lock has been acquired in
__thermal_cooling_device_register(), it is not necessary to drop it
and take it again until all of the thermal zones have been updated,
so change the code accordingly.

No expected functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-04-03 20:40:21 +02:00
Daniel Lezcano
32a7a02117 thermal/core: Relocate the traces definition in thermal directory
The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.

Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org
2023-04-01 20:51:45 +02:00
Rafael J. Wysocki
ce07727aff Merge back thermal control material for 6.4-rc1. 2023-03-27 13:46:13 +02:00
Rafael J. Wysocki
6babf38d89 Merge branch 'thermal-acpi'
Merge a fix for a recent thermal-related regression in the ACPI
processor driver.

* thermal-acpi:
  ACPI: processor: thermal: Update CPU cooling devices on cpufreq policy changes
  thermal: core: Introduce thermal_cooling_device_update()
  thermal: core: Introduce thermal_cooling_device_present()
  ACPI: processor: Reorder acpi_processor_driver_init()
2023-03-24 17:11:27 +01:00
Ido Schimmel
f1b80a3878 thermal: core: Restore behavior regarding invalid trip points
Commit 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip()
function") stopped marking trip points with a zero temperature as
disabled, behavior that was originally introduced in commit 81ad4276b5
("Thermal: Ignore invalid trip points").

When using the mlxsw driver we see that when such trip points are not
disabled, the thermal subsystem repeatedly tries to set the state of the
associated cooling devices to the maximum state.

Address this by restoring the original behavior and mark trip points
with a zero temperature as disabled.

Fixes: 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip() function")
Signed-off-by: Ido Schimmel <idosch@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-22 19:59:08 +01:00
Rafael J. Wysocki
790930f442 thermal: core: Introduce thermal_cooling_device_update()
Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.

That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state.  Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).

The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.

Note that the actual user of the new function will be added separately.

Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-03-22 15:20:38 +01:00
Rafael J. Wysocki
c43198af05 thermal: core: Introduce thermal_cooling_device_present()
Introduce a helper function, thermal_cooling_device_present(), for
checking if the given cooling device is in the list of registered
cooling devices to avoid some code duplication in a subsequent
patch.

No expected functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-03-22 15:20:38 +01:00
Daniel Lezcano
3034f859b9 thermal: Add a thermal zone id accessor
In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.

Use the accessor in the hwmon_scmi and acpi_thermal.

No functional change intented.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano
072e35c988 thermal/core: Add thermal_zone_device structure 'type' accessor
The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano
a6ff3c0021 thermal/core: Add a thermal zone 'devdata' accessor
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
ye xingchen
5bbafd4362 thermal: core: Use sysfs_emit_at() instead of scnprintf()
Follow the advice in Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.

Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 20:39:48 +01:00
Rafael J. Wysocki
9e0a9be24b thermal: Fail object registration if thermal class is not registered
If thermal_class is not registered with the driver core, there is no way
to expose the interfaces used by the thermal control framework, so
prevent thermal zones and cooling devices from being registered in
that case by returning an error from object registration functions.

For this purpose, use a thermal_class pointer that will be NULL if the
class is not registered.  To avoid wasting memory in that case, allocate
the thermal class object dynamically and if it fails to register, free
it and clear the thermal_class pointer to NULL.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2023-01-25 16:51:19 +01:00
Daniel Lezcano
5b8de18ee9 thermal/core: Move the thermal trip code to a dedicated file
The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...

This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.

For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.

The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 16:40:39 +01:00
Daniel Lezcano
b57d62862d thermal/core: Remove unneeded ida_destroy()
As per documentation for the ida_destroy() function: "If the IDA is
already empty, there is no need to call this function."

The thermal framework is in the init sequence, so the ida was not yet
used and consequently it is empty in case of error.

There is no need to call ida_destroy(), let's remove the calls.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 16:40:39 +01:00
Daniel Lezcano
58d1c9fd0e thermal/core: Fix unregistering netlink at thermal init time
The thermal subsystem initialization miss an netlink unregistering
function in the error. Add it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 16:40:39 +01:00
Viresh Kumar
47e3f00074 thermal: core: Use device_unregister() instead of device_del/put()
Lets not open code device_unregister() unnecessarily.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-24 20:22:55 +01:00
Viresh Kumar
e398421fd0 thermal: core: Move cdev cleanup to thermal_release()
thermal_release() already frees cdev, let it do rest of the cleanup as
well in order to simplify the error paths in
__thermal_cooling_device_register().

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-24 20:21:49 +01:00
Rafael J. Wysocki
a2c81dc59d Merge back thermal control material for 6.3. 2023-01-23 18:52:53 +01:00
Viresh Kumar
6c54b7bc8a thermal: core: call put_device() only after device_register() fails
put_device() shouldn't be called before a prior call to
device_register(). __thermal_cooling_device_register() doesn't follow
that properly and needs fixing. Also
thermal_cooling_device_destroy_sysfs() is getting called unnecessarily
on few error paths.

Fix all this by placing the calls at the right place.

Based on initial work done by Caleb Connolly.

Fixes: 4748f9687c ("thermal: core: fix some possible name leaks in error paths")
Fixes: c408b3d1d9 ("thermal: Validate new state in cur_state_store()")
Reported-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Frank Rowand <frowand.list@gmail.com>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Tested-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-19 21:06:41 +01:00
Johan Hovold
e6ec64f852 thermal/drivers/qcom: Fix set_trip_temp() deadlock
The set_trip_temp() callback is used when changing the trip temperature
through sysfs. As it is called with the thermal-zone-device lock held
it must not use thermal_zone_get_trip() directly or it will deadlock.

Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-2-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2023-01-06 14:14:48 +01:00
Daniel Lezcano
2e38a2a981 thermal/core: Add a generic thermal_zone_set_trip() function
The thermal zone ops defines a set_trip callback where we can invoke
the backend driver to set an interrupt for the next trip point
temperature being crossed the way up or down, or setting the low level
with the hysteresis.

The ops is only called from the thermal sysfs code where the userspace
has the ability to modify a trip point characteristic.

With the effort of encapsulating the thermal framework core code,
let's create a thermal_zone_set_trip() which is the writable side of
the thermal_zone_get_trip() and put there all the ops encapsulation.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-4-daniel.lezcano@linaro.org
2023-01-06 14:14:47 +01:00
Daniel Lezcano
7c3d5c20dc thermal/core: Add a generic thermal_zone_get_trip() function
The thermal_zone_device_ops structure defines a set of ops family,
get_trip_temp(), get_trip_hyst(), get_trip_type(). Each of them is
returning a property of a trip point.

The result is the code is calling the ops everywhere to get a trip
point which is supposed to be defined in the backend driver. It is a
non-sense as a thermal trip can be generic and used by the backend
driver to declare its trip points.

Part of the thermal framework has been changed and all the OF thermal
drivers are using the same definition for the trip point and use a
thermal zone registration variant to pass those trip points which are
part of the thermal zone device structure.

Consequently, we can use a generic function to get the trip points
when they are stored in the thermal zone device structure.

This approach can be generalized to all the drivers and we can get rid
of the ops->get_trip_*. That will result to a much more simpler code
and make possible to rework how the thermal trip are handled in the
thermal core framework as discussed previously.

This change adds a function thermal_zone_get_trip() where we get the
thermal trip point structure which contains all the properties (type,
temp, hyst) instead of doing multiple calls to ops->get_trip_*.

That opens the door for trip point extension with more attributes. For
instance, replacing the trip points disabled bitmask with a 'disabled'
field in the structure.

Here we replace all the calls to ops->get_trip_* in the thermal core
code with a call to the thermal_zone_get_trip() function.

The thermal zone ops defines a callback to retrieve the critical
temperature. As the trip handling is being reworked, all the trip
points will be the same whatever the driver and consequently finding
the critical trip temperature will be just a loop to search for a
critical trip point type.

Provide such a generic function, so we encapsulate the ops
get_crit_temp() which can be removed when all the backend drivers are
using the generic trip points handling.

While at it, add the thermal_zone_get_num_trips() to encapsulate the
code more and reduce the grip with the thermal framework internals.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-2-daniel.lezcano@linaro.org
2023-01-06 14:14:47 +01:00
Yang Yingliang
4748f9687c thermal: core: fix some possible name leaks in error paths
In some error paths before device_register(), the names allocated
by dev_set_name() are not freed. Move dev_set_name() front to
device_register(), so the name can be freed while calling
put_device().

Fixes: 1dd7128b83 ("thermal/core: Fix null pointer dereference in thermal_release()")
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-25 19:51:41 +01:00
Guenter Roeck
b778b4d782 thermal/core: Protect thermal device operations against thermal device removal
Thermal device operations may be called after thermal zone device removal.
After thermal zone device removal, thermal zone device operations must
no longer be called. To prevent such calls from happening, ensure that
the thermal device is registered before executing any thermal device
operations.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck
05eeee2b51 thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex
Protect access to thermal operations against thermal zone removal by
acquiring the thermal zone device mutex. After acquiring the mutex, check
if the thermal zone device is registered and abort the operation if not.

With this change, we can call __thermal_zone_device_update() instead of
thermal_zone_device_update() from trip_point_temp_store() and from
emul_temp_store(). Similar, we can call __thermal_zone_set_trips() instead
of thermal_zone_set_trips() from trip_point_hyst_store().

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck
1c439dec35 thermal/core: Introduce locked version of thermal_zone_device_update
In thermal_zone_device_set_mode(), the thermal zone mutex is released only
to be reacquired in the subsequent call to thermal_zone_device_update().

Introduce __thermal_zone_device_update(), which is similar to
thermal_zone_device_update() but has to be called with the thermal device
mutex held. Call the new function from thermal_zone_device_set_mode()
to avoid the extra thermal device mutex release/acquire sequence in that
function.

With the new function in place, re-implement thermal_zone_device_update()
as wrapper around __thermal_zone_device_update() to acquire and release
the thermal device mutex.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck
30b2ae07d3 thermal/core: Delete device under thermal device zone lock
Thermal device attributes may still be opened after unregistering
the thermal zone and deleting the thermal device.

Currently there is no protection against accessing thermal device
operations after unregistering a thermal zone. To enable adding
such protection, protect the device delete operation with the
thermal zone device mutex. This requires splitting the call to
device_unregister() into its components, device_del() and put_device().
Only the first call can be executed under mutex protection, since
put_device() may result in releasing the thermal zone device memory.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck
d35f29ed9d thermal/core: Destroy thermal zone device mutex in release function
Accesses to thermal zones, and with it the thermal zone device mutex,
are still possible after the thermal zone device has been unregistered.
For example, thermal_zone_get_temp() can be called from temp_show()
in thermal_sysfs.c if the sysfs attribute was opened before the thermal
device was unregistered.

Move the call to mutex_destroy from thermal_zone_device_unregister()
to thermal_release() to ensure that it is only destroyed after it is
guaranteed to be no longer accessed.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Dan Carpenter
e49a1e1ee0 thermal/core: fix error code in __thermal_cooling_device_register()
Return an error pointer if ->get_max_state() fails.  The current code
returns NULL which will cause an oops in the callers.

Fixes: c408b3d1d9 ("thermal: Validate new state in cur_state_store()")
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-28 19:59:51 +02:00
Viresh Kumar
c408b3d1d9 thermal: Validate new state in cur_state_store()
In cur_state_store(), the new state of the cooling device is received
from user-space and is not validated by the thermal core but the same is
left for the individual drivers to take care of. Apart from duplicating
the code it leaves possibility for introducing bugs where a driver may
not do it right.

Lets make the thermal core check the new state itself and store the max
value in the cooling device structure.

Link: https://lore.kernel.org/all/Y0ltRJRjO7AkawvE@kili/
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-25 18:58:11 +02:00
Lad Prabhakar
c71d8035f1 thermal/core: Drop valid pointer check for type
Drop the valid pointer check for type in
thermal_zone_device_register_with_trips() as we already have it confirmed
for != NULL from the previous if block.

Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20220909181322.10933-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-10-04 11:21:30 +02:00
Sumeet Pawnikar
82b1ec794d thermal: core: Increase maximum number of trip points
On one of the Chrome system, if we define more than 12 trip points,
probe for thermal sensor fails with
"int3403 thermal: probe of INTC1046:03 failed with error -22"
and throws an error as
"thermal_sys: Error: Incorrect number of thermal trips".

The thermal_zone_device_register() interface needs maximum
number of trip points supported in a zone as an argument.
This number can't exceed THERMAL_MAX_TRIPS, which is currently
set to 12. To address this issue, THERMAL_MAX_TRIPS value
has to be increased.

This interface also has an argument to specify a mask of trips
which are writable. This mask is defined as an int.
This mask sets the ceiling for increasing maximum number of
supported trips. With the current implementation, maximum number
of trips can be supported is 31.

Also, THERMAL_MAX_TRIPS macro is used in one place only.
So, remove THERMAL_MAX_TRIPS macro and compare num_trips
directly with using a macro BITS_PER_TYPE(int)-1.

Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-09-30 19:50:10 +02:00
Wolfram Sang
1e6c8fb8b8 thermal: move from strlcpy() with unused retval to strscpy()
Follow the advice of the below link and prefer 'strscpy' in this
subsystem. Conversion is 1:1 because the return value is not used.
Generated by a coccinelle script.

Link: https://lore.kernel.org/r/CAHk-=wgfRnXz0W3D37d01q3JFkr_i_uTL=V6A6G1oUZcprmknw@mail.gmail.com/
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-08-31 21:13:35 +02:00
Daniel Lezcano
2f9d142c93 thermal/core: Fix lockdep_assert() warning
The function thermal_zone_device_is_enabled() must be called with the
thermal zone lock held. In the resume path, it is called without.

As the thermal_zone_device_is_enabled() is also checked in
thermal_zone_device_update(), do the check in resume() function is
pointless, except for saving an extra initialization which does not
hurt if it is done in all the cases.

Fixes: ca48ad71717dd ("thermal/core: Move the mutex inside the thermal_zone_device_update() function")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reported-by: Marek Szyprowski <m.szyprowski@samsung.com>
Tested-by: Marek Szyprowski <m.szyprowski@samsung.com>
2022-08-17 14:09:39 +02:00
Daniel Lezcano
a930da9bf5 thermal/core: Move the mutex inside the thermal_zone_device_update() function
All the different calls inside the thermal_zone_device_update()
function take the mutex.

The previous changes move the mutex out of the different functions,
like the throttling ops. Now that the mutexes are all at the same
level in the call stack for the thermal_zone_device_update() function,
they can be moved inside this one.

That has the benefit of:

1. Simplify the code by not having a plethora of places where the lock is taken

2. Probably closes more race windows because releasing the lock from
one line to another can give the opportunity to the thermal zone to change
its state in the meantime. For example, the thermal zone can be
enabled right after checking it is disabled.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220805153834.2510142-5-daniel.lezcano@linaro.org
2022-08-17 14:09:39 +02:00
Daniel Lezcano
670a5e356c thermal/core: Move the thermal zone lock out of the governors
All the governors throttling ops are taking/releasing the lock at the
beginning and the end of the function.

We can move the mutex to the throttling call site instead.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220805153834.2510142-4-daniel.lezcano@linaro.org
2022-08-17 14:09:39 +02:00
Daniel Lezcano
15a73839e3 thermal/core: Rework the monitoring a bit
The should_stop_polling() function wraps the function
thermal_zone_device_is_enabled().

The monitor_thermal_zone() function checks if the thermal zone is
enabled via the should_stop_polling() function.

However, the instant after checking the thermal zone is enabled, this
one can be disabled, so even if that reduces the race window, it does
not prevent that and the monitoring can be set again with the thermal
zone disabled.

For this reason, the function should_stop_polling() is replaced by a
direct check of the thermal zone mode with the mutex locks held, that
prevents the situation described above.

As the semantic is clear with the thermal_zone_is_enabled() function,
we can remove the should_stop_polling() function and replace the check
with the former function.

While at it, reorder the checks to improve the readability of the
monitor_thermal_zone() function.

In the future, the thermal_zone_device_disable() and the
thermal_zone_device_enable() functions should unset / set the polling
timer directly instead of relying on the next
thermal_zone_device_update() call to do that. That will make a
synchronous thermal zone mode change but the locking scheme should be
double checked for that which out of the scope of this change.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220805153834.2510142-2-daniel.lezcano@linaro.org
2022-08-17 14:09:39 +02:00
Daniel Lezcano
9662756a9a thermal/core: Rearm the monitoring only one time
The current code calls monitor_thermal_zone() inside the
handle_thermal_trip() function. But this one is called in a loop for
each trip point which means the monitoring is rearmed several times
for nothing (assuming there could be several passive and active trip
points).

Move the monitor_thermal_zone() function out of the
handle_thermal_trip() function and after the thermal trip loop, so the
timer will be disabled or rearmed one time.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220805153834.2510142-1-daniel.lezcano@linaro.org
2022-08-17 14:09:39 +02:00
Daniel Lezcano
48ad3b104b thermal/of: Make new code and old code co-exist
This transient change allows to use old and new OF together until all
the drivers are converted to use the new OF API.

This will go away when the old OF code will be removed.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-3-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-08-17 14:09:37 +02:00
Daniel Lezcano
a921be53b4 thermal/core: Add missing EXPORT_SYMBOL_GPL
The function thermal_zone_device_register_with_trips() is not exported
for modules.

Add the missing EXPORT_SYMBOL_GPL().

Fixes: fae11de507 ("thermal/core: Add thermal_trip in thermal_zone")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220810100731.749317-1-daniel.lezcano@linaro.org
2022-08-15 20:38:19 +02:00
Rafael J. Wysocki
da9d01794e - Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
   (Lukasz Luba)
 
 - Add the include/dt-bindings/thermal.h under the area covered by the
   thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
 
 - Improve the error output by giving the sensor identification when a
   thermal zone failed to initialize, the DT bindings by changing the
   positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
   Sang)
 
 - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
   Kozlowski)
 
 - Remove the pointless get_trend() function in the QCom, Ux500 and
   tegra thermal drivers, along with the unused DROP_FULL and
   RAISE_FULL trends definitions. Simplify the code by using clamp()
   macros (Daniel Lezcano)
 
 - Fix ref_table memory leak at probe time on the k3_j72xx bandgap
   (Bryan Brattlof)
 
 - Fix array underflow in prep_lookup_table (Dan Carpenter)
 
 - Add static annotation to the k3_j72xx_bandgap_j7* data structure
   (Jin Xiaoyun)
 
 - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
 
 - Fix typos in comments on rzg2l (Biju Das)
 
 - Remove as unnecessary call to dev_err() as the error is already
   printed by the failing function on u8500 (Yang Li)
 
 - Register the thermal zones as hwmon sensors for the Qcom thermal
   sensors (Dmitry Baryshkov)
 
 - Fix 'tmon' tool compilation issue by adding phtread.h include
   (Markus Mayer)
 
 - Fix typo in the comments for the 'tmon' tool (Slark Xiao)
 
 - Consolidate the thermal core code by beginning to move the thermal
   trip structure from the thermal OF code as a generic structure to be
   used by the different sensors when registering a thermal zone
   (Daniel Lezcano)
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Merge tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal control changes for 5.20-rc1 from Daniel Lezcano:

"- Make per cpufreq / devfreq cooling device ops instead of using a
   global variable, fix comments and rework the trace information
   (Lukasz Luba)

 - Add the include/dt-bindings/thermal.h under the area covered by the
   thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)

 - Improve the error output by giving the sensor identification when a
   thermal zone failed to initialize, the DT bindings by changing the
   positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
   Sang)

 - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
   Kozlowski)

 - Remove the pointless get_trend() function in the QCom, Ux500 and
   tegra thermal drivers, along with the unused DROP_FULL and
   RAISE_FULL trends definitions. Simplify the code by using clamp()
   macros (Daniel Lezcano)

 - Fix ref_table memory leak at probe time on the k3_j72xx bandgap
   (Bryan Brattlof)

 - Fix array underflow in prep_lookup_table (Dan Carpenter)

 - Add static annotation to the k3_j72xx_bandgap_j7* data structure
   (Jin Xiaoyun)

 - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)

 - Fix typos in comments on rzg2l (Biju Das)

 - Remove as unnecessary call to dev_err() as the error is already
   printed by the failing function on u8500 (Yang Li)

 - Register the thermal zones as hwmon sensors for the Qcom thermal
   sensors (Dmitry Baryshkov)

 - Fix 'tmon' tool compilation issue by adding phtread.h include
   (Markus Mayer)

 - Fix typo in the comments for the 'tmon' tool (Slark Xiao)

 - Consolidate the thermal core code by beginning to move the thermal
   trip structure from the thermal OF code as a generic structure to be
   used by the different sensors when registering a thermal zone
   (Daniel Lezcano)"

* tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits)
  thermal/of: Initialize trip points separately
  thermal/of: Use thermal trips stored in the thermal zone
  thermal/core: Add thermal_trip in thermal_zone
  thermal/core: Rename 'trips' to 'num_trips'
  thermal/core: Move thermal_set_delay_jiffies to static
  thermal/core: Remove unneeded EXPORT_SYMBOLS
  thermal/of: Move thermal_trip structure to thermal.h
  thermal/of: Remove the device node pointer for thermal_trip
  thermal/of: Replace device node match with device node search
  thermal/core: Remove duplicate information when an error occurs
  thermal/core: Avoid calling ->get_trip_temp() unnecessarily
  thermal/tools/tmon: Fix typo 'the the' in comment
  thermal/tools/tmon: Include pthread and time headers in tmon.h
  thermal/ti-soc-thermal: Fix comment typo
  thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
  thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
  thermal/drivers/u8500: Remove unnecessary print function dev_err()
  thermal/drivers/rzg2l: Fix comments
  thermal/drivers/sun8i: Fix typo in comment
  thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
  ...
2022-07-29 19:10:56 +02:00
Daniel Lezcano
fae11de507 thermal/core: Add thermal_trip in thermal_zone
The thermal trip points are properties of a thermal zone and the
different sub systems should be able to save them in the thermal zone
structure instead of having their own definition.

Give the opportunity to the drivers to create a thermal zone with
thermal trips which will be accessible directly from the thermal core
framework.

As we added the thermal trip points structure in the thermal zone,
let's extend the thermal zone register function to have the thermal
trip structures as a parameter and store it in the 'trips' field of
the thermal zone structure.

The thermal zone contains the trip point, we can store them directly
when registering the thermal zone. That will allow another step
forward to remove the duplicate thermal zone structure we find in the
thermal_of code.

Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-9-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28 17:29:56 +02:00
Daniel Lezcano
e5bfcd30f8 thermal/core: Rename 'trips' to 'num_trips'
In order to use thermal trips defined in the thermal structure, rename
the 'trips' field to 'num_trips' to have the 'trips' field containing the
thermal trip points.

Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28 17:29:56 +02:00
Daniel Lezcano
e5f2cda61d thermal/core: Move thermal_set_delay_jiffies to static
The function 'thermal_set_delay_jiffies' is only used in
thermal_core.c but it is defined and implemented in a separate
file. Move the function to thermal_core.c and make it static.

Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20220722200007.1839356-7-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28 17:29:55 +02:00
Daniel Lezcano
3f95ac3245 thermal/core: Remove duplicate information when an error occurs
The pr_err already tells it is an error, it is pointless to add the
'Error:' string in the messages. Remove them.

Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20220722200007.1839356-2-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28 17:29:53 +02:00
Daniel Lezcano
50e53291e9 thermal/core: Avoid calling ->get_trip_temp() unnecessarily
As the trip temperature is already available when calling the function
handle_critical_trips(), pass it as a parameter instead of having this
function calling the ops again to retrieve the same data.

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220718145038.1114379-2-daniel.lezcano@linaro.org
2022-07-28 17:29:52 +02:00
keliu
5a5b7d8d54 thermal: Directly use ida_alloc()/free()
Use ida_alloc()/ida_free() instead of deprecated
ida_simple_get()/ida_simple_remove() as recommended.

Signed-off-by: keliu <liuke94@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-06-14 16:05:35 +02:00
Yang Yingliang
98a160e898 thermal/core: Fix memory leak in __thermal_cooling_device_register()
I got memory leak as follows when doing fault injection test:

unreferenced object 0xffff888010080000 (size 264312):
  comm "182", pid 102533, jiffies 4296434960 (age 10.100s)
  hex dump (first 32 bytes):
    00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00  .....N..........
    ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff  ........@.......
  backtrace:
    [<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969
    [<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510
    [<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586
    [<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927
    [<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041
    [<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211
    [<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561

If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called
to free the memory allocated in thermal_cooling_device_setup_sysfs().

Fixes: 8ea229511e ("thermal: Add cooling device's statistics in sysfs")
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Link: https://lore.kernel.org/r/20220511020605.3096734-1-yangyingliang@huawei.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:53 +02:00