Pull x86 topology updates from Ingo Molnar:
"Implement multi-die topology support on Intel CPUs and expose the die
topology to user-space tooling, by Len Brown, Kan Liang and Zhang Rui.
These changes should have no effect on the kernel's existing
understanding of topologies, i.e. there should be no behavioral impact
on cache, NUMA, scheduler, perf and other topologies and overall
system performance"
* 'x86-topology-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip:
perf/x86/intel/rapl: Cosmetic rename internal variables in response to multi-die/pkg support
perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support
hwmon/coretemp: Cosmetic: Rename internal variables to zones from packages
thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages
perf/x86/intel/cstate: Support multi-die/package
perf/x86/intel/rapl: Support multi-die/package
perf/x86/intel/uncore: Support multi-die/package
topology: Create core_cpus and die_cpus sysfs attributes
topology: Create package_cpus sysfs attribute
hwmon/coretemp: Support multi-die/package
powercap/intel_rapl: Update RAPL domain name and debug messages
thermal/x86_pkg_temp_thermal: Support multi-die/package
powercap/intel_rapl: Support multi-die/package
powercap/intel_rapl: Simplify rapl_find_package()
x86/topology: Define topology_logical_die_id()
x86/topology: Define topology_die_id()
cpu/topology: Export die_id
x86/topology: Create topology_max_die_per_package()
x86/topology: Add CPUID.1F multi-die/package support
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for more details you should have received a copy of the gnu general
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this program is free software you can redistribute it and or modify
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Pull thermal SoC fix from Eduardo Valentin:
"A single revert, detected to cause issues on the tsens driver"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
Revert "drivers: thermal: tsens: Add new operation to check if a sensor is enabled"
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this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license as published by
the free software foundation either version 2 of the license or at
your option any later version [author] [kishon] [vijay] [abraham]
[i] [kishon]@[ti] [com] this program is distributed in the hope that
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the gnu general public license for more details
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your option any later version [author] [graeme] [gregory]
[gg]@[slimlogic] [co] [uk] [author] [kishon] [vijay] [abraham] [i]
[kishon]@[ti] [com] [based] [on] [twl6030]_[usb] [c] [author] [hema]
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purpose see the gnu general public license for more details you
should have received a copy of the gnu general public license along
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Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This reverts commit 3e6a8fb330.
Cc: Andy Gross <agross@kernel.org>
Cc: David Brown <david.brown@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Suggested-by: Amit Kucheria <amit.kucheria@linaro.org>
Reported-by: Andy Gross <andygro@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Update the formula to calculate temperature:
Currently, current TEMP is calculated as
average of val1 (is calculated by formula 1)
and val2 (is calculated by formula 2). But,
as description in HWM (chapter 10A.3.1.2 Normal Mode.)
If (TEMP_CODE < THCODE2[11:0]) CTEMP value should be val1.
If (TEMP_CODE > THCODE2[11:0]) CTEMP value should be val2.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Update the formula to calculate CTEMP:
Currently, the CTEMP is average of val1 (is calculated by
formula 1) and val2 (is calculated by formula 2). But,
as description in HWM (chapter 10A.3.1.1 Setting of Normal Mode)
If (STEMP < Tj_T) CTEMP value should be val1.
If (STEMP > Tj_T) CTEMP value should be val2.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
As evaluation of hardware team, temperature calculation formula
of M3-W is difference from all other SoCs as below:
- M3-W: Tj_1: 116 (so Tj_1 - Tj_3 = 157)
- Others: Tj_1: 126 (so Tj_1 - Tj_3 = 167)
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Fix sparse warning:
drivers/thermal/tegra/tegra210-soctherm.c:211:33: warning:
symbol 'tegra210_tsensor_thermtrips' was not declared. Should it be static?
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: YueHaibing <yuehaibing@huawei.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This reverts commit 28694e009e.
The commit causes multiple issues in that:
- the added call to ->control does potentially run unclocked
causing a hang of the machine
- the added pinctrl-states are undocumented in the binding
- the added pinctrl-states are not backwards compatible, breaking
old devicetrees.
Fixes: 28694e009e ("thermal: rockchip: fix up the tsadc pinctrl setting error")
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Reported-by: kernelci.org bot <bot@kernelci.org>
Reported-by: Enric Balletbo Serra <eballetbo@gmail.com>
Reported-by: Vicente Bergas <vicencb@gmail.com>
Reported-by: Jack Mitchell <ml@embed.me.uk>
Reported-by: Douglas Anderson <dianders@chromium.org>
Tested-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Syntax update only -- no logical or functional change.
In response to the new multi-die/package changes, update variable names to
use the more generic thermal "zone" terminology, instead of "package", as
the zones can refer to either packages or die.
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Link: https://lkml.kernel.org/r/b65494a76be13481dc3a809c75debb2574c34eda.1557769318.git.len.brown@intel.com
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.
Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
Add SPDX license identifiers to all Make/Kconfig files which:
- Have no license information of any form
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Add SPDX license identifiers to all files which:
- Have no license information of any form
- Have MODULE_LICENCE("GPL*") inside which was used in the initial
scan/conversion to ignore the file
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Pull thermal management updates from Zhang Rui:
- Remove the 'module' Kconfig option for thermal subsystem framework
because the thermal framework are required to be ready as early as
possible to avoid overheat at boot time (Daniel Lezcano)
- Fix a bug that thermal framework pokes disabled thermal zones upon
resume (Wei Wang)
- A couple of cleanups and trivial fixes on int340x thermal drivers
(Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
drivers: thermal: processor_thermal: Downgrade error message
mlxsw: Remove obsolete dependency on THERMAL=m
hwmon/drivers/core: Simplify complex dependency
thermal/drivers/core: Fix typo in the option name
thermal/drivers/core: Remove depends on THERMAL in Kconfig
thermal/drivers/core: Remove module unload code
thermal/drivers/core: Remove the module Kconfig's option
thermal: core: skip update disabled thermal zones after suspend
thermal: make device_register's type argument const
thermal: intel: int340x: processor_thermal_device: simplify to get driver data
thermal/int3403_thermal: favor _TMP instead of PTYP
Pull thermal soc updates from Eduardo Valentin:
- thermal core has a new devm_* API for registering cooling devices. I
took the entire series, that is why you see changes on drivers/hwmon
in this pull (Guenter Roeck)
- rockchip thermal driver gains support to PX30 SoC (Elaine Zhang)
- the generic-adc thermal driver now considers the lookup table DT
property as optional (Jean-Francois Dagenais)
- Refactoring of tsens thermal driver (Amit Kucheria)
- Cleanups on cpu cooling driver (Daniel Lezcano)
- broadcom thermal driver dropped support to ACPI (Srinath Mannam)
- tegra thermal driver gains support to OC hw throttle and GPU throtle
(Wei Ni)
- Fixes in several thermal drivers.
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (59 commits)
hwmon: (pwm-fan) Use devm_thermal_of_cooling_device_register
hwmon: (npcm750-pwm-fan) Use devm_thermal_of_cooling_device_register
hwmon: (mlxreg-fan) Use devm_thermal_of_cooling_device_register
hwmon: (gpio-fan) Use devm_thermal_of_cooling_device_register
hwmon: (aspeed-pwm-tacho) Use devm_thermal_of_cooling_device_register
thermal: rcar_gen3_thermal: Fix to show correct trip points number
thermal: rcar_thermal: update calculation formula for R-Car Gen3 SoCs
thermal: cpu_cooling: Actually trace CPU load in thermal_power_cpu_get_power
thermal: rockchip: Support the PX30 SoC in thermal driver
dt-bindings: rockchip-thermal: Support the PX30 SoC compatible
thermal: rockchip: fix up the tsadc pinctrl setting error
thermal: broadcom: Remove ACPI support
thermal: Fix build error of missing devm_ioremap_resource on UM
thermal/drivers/cpu_cooling: Remove pointless field
thermal/drivers/cpu_cooling: Add Software Package Data Exchange (SPDX)
thermal/drivers/cpu_cooling: Fixup the header and copyright
thermal/drivers/cpu_cooling: Remove pointless test in power2state()
thermal: rcar_gen3_thermal: disable interrupt in .remove
thermal: rcar_gen3_thermal: fix interrupt type
thermal: Introduce devm_thermal_of_cooling_device_register
...
Currently after store trip points number in 'ret', it is overwritten
afterwards, this cause incorrect trip point number always be shown in
the debug information after register of each thermal zone.
This patch fix this issue by moving get of trip number to
end of thermal zone registration.
Fixes: 6269e9f790 ("thermal: rcar_gen3_thermal: Register hwmon sysfs interface")
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Update calculation for the R-Car Gen3 and RZ/G2 SoCs which have a
thermal IP block controlled by this driver. That is the:
* R-Car D3 (r8a77995)
* R-Car E2 (r8a77990)
* R-Car V3M (r8a77970)
* RZ/G2E (r8a774c0)
The calculation update is as documented in the R-Car Gen3 User's Manual,
v1.50 Nov 2018:
- When CTEMP is less than 24
T = CTEMP[5:0] * 5.5 - 72
- When CTEMP is equal to/greater than 24
T = CTEMP[5:0] * 5 - 60
This was inspired by a patch in the BSP by Van Do <van.do.xw@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The CPU load values passed to the thermal_power_cpu_get_power
tracepoint are zero for all CPUs, unless, unless the
thermal_power_cpu_limit tracepoint is enabled too:
irq/41-rockchip-98 [000] .... 290.972410: thermal_power_cpu_get_power:
cpus=0000000f freq=1800000 load={{0x0,0x0,0x0,0x0}} dynamic_power=4815
vs
irq/41-rockchip-96 [000] .... 95.773585: thermal_power_cpu_get_power:
cpus=0000000f freq=1800000 load={{0x56,0x64,0x64,0x5e}} dynamic_power=4959
irq/41-rockchip-96 [000] .... 95.773596: thermal_power_cpu_limit:
cpus=0000000f freq=408000 cdev_state=10 power=416
There seems to be no good reason for omitting the CPU load information
depending on another tracepoint. My guess is that the intention was to
check whether thermal_power_cpu_get_power is (still) enabled, however
'load_cpu != NULL' already indicates that it was at least enabled when
cpufreq_get_requested_power() was entered, there seems little gain
from omitting the assignment if the tracepoint was just disabled, so
just remove the check.
Fixes: 6828a4711f ("thermal: add trace events to the power allocator governor")
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Javi Merino <javi.merino@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
PX30 SOC has two Temperature Sensors for CPU and GPU.
Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Explicitly use the pinctrl to set/unset the right mode
instead of relying on the pinctrl init mode.
And it requires setting the tshut polarity before select pinctrl.
When the temperature sensor mode is set to 0, it will automatically
reset the board via the Clock-Reset-Unit (CRU) if the over temperature
threshold is reached. However, when the pinctrl initializes, it does a
transition to "otp_out" which may lead the SoC restart all the time.
"otp_out" IO may be connected to the RESET circuit on the hardware.
If the IO is in the wrong state, it will trigger RESET.
(similar to the effect of pressing the RESET button)
which will cause the soc to restart all the time.
Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Unlike DT framework, thermal-zones and its parameters can't be parsed
using ACPI framework. So that ACPI support is removed in this driver.
Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com>
Reported-by: David Woodhouse <dwmw2@infradead.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:
drivers/thermal/thermal_mmio.o:
In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1):
undefined reference to `devm_ioremap_resource'
The users of devm_ioremap_resource() which are compile-testable
should depend on HAS_IOMEM.
Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Talel Shenhar <talel@amazon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The structure cpufreq_cooling_device provides a backpointer to the thermal
device but this one is used for a trace and to unregister. For the trace,
we don't really need this field and the unregister function as the same
pointer passed as parameter. Remove it.
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The copyright format does not conform to the format requested by
Linaro: https://wiki.linaro.org/Copyright
Fix it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When the static power computation was removed, the test with the power
being negative was not removed. However, the substraction which was
responsible of the negative value was removed and the variable is now
an u32. A double reason to remove the test which does not make sense.
Fixes: 84fe2cab48 ("cpu_cooling: Drop static-power related stuff")
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently IRQ remains enabled after .remove, later if device is probed,
IRQ is requested before .thermal_init, this may cause IRQ function be
called before device is initialized.
this patch disables interrupt in .remove, to ensure irq function
only be called after device is fully initialized.
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently IRQF_SHARED type interrupt line is allocated, but it
is not appropriate, as the interrupt line isn't shared between
different devices, instead IRQF_ONESHOT is the proper type.
By changing interrupt type to IRQF_ONESHOT, now irq handler is
no longer needed, as clear of interrupt status can be done in
threaded interrupt context.
Because IRQF_ONESHOT type interrupt line is kept disabled until
the threaded handler has been run, so there is no need to protect
read/write of REG_GEN3_IRQSTR with lock.
Fixes: 7d4b269776 ("enable hardware interrupts for trip points")
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
thermal_of_cooling_device_register() and thermal_cooling_device_register()
are typically called from driver probe functions, and
thermal_cooling_device_unregister() is called from remove functions. This
makes both a perfect candidate for device managed functions.
Introduce devm_thermal_of_cooling_device_register(). This function can
also be used to replace thermal_cooling_device_register() by passing a NULL
pointer as device node. The new function requires both struct device *
and struct device_node * as parameters since the struct device_node *
parameter is not always identical to dev->of_node.
Don't introduce a device managed remove function since it is not needed
at this point.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Certain ADC channels, such as the xilinx-ams temperature channels, give
milliCelcius already when read with iio_read_channel_processed.
Rather than having to provide a 1:1 dummy lookup table, simply allow to
bypass the mechanism.
Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's impossible to use this driver outside of Device Tree, so if the
probe function is called, the dev.of_node is guaranteed to not be NULL
and guarding against that is pointless. Drop it.
Signed-off-by: Andrey Smirnov <andrew.smirnov@gmail.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Chris Healy <cphealy@gmail.com>
Cc: Lucas Stach <l.stach@pengutronix.de>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Angus Ainslie (Purism) <angus@akkea.ca>
Cc: linux-imx@nxp.com
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.
This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.
Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Fix setting value for IRQCTL register. We are setting the last 6 bits
of (IRQCTL) to be 1 (0x3f), this is only suitable for H3ES1.*, according
to Hardware manual values 1 are "setting prohibited" for Gen3.
Signed-off-by: Hoan Nguyen An <na-hoan@jinso.co.jp>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This will allow calibration routines to correctly include the constants
from anywhere and allow more code sharing.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
qcs404 has a single TSENS IP block with 10 sensors. It uses version 1.4
of the TSENS IP, functionality for which is encapsulated inside the
qcom,tsens-v1 compatible.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
