- Add debugfs-based diagnostics support to the thermal core (Daniel
Lezcano, Dan Carpenter).
- Fix a power allocator thermal governor issue preventing it from
resetting cooling devices sometimes (Di Shen).
- Simplify the thermal netlink API and clean up related code (Rafael J.
Wysocki).
- Make the Intel HFI driver support hibernation and deep suspend
properly (Ricardo Neri).
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Merge tag 'thermal-6.8-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These add support for debugfs-based diagnostics to the thermal core,
simplify the thermal netlink API, fix system-wide PM support in the
Intel HFI driver and clean up some code.
Specifics:
- Add debugfs-based diagnostics support to the thermal core (Daniel
Lezcano, Dan Carpenter)
- Fix a power allocator thermal governor issue preventing it from
resetting cooling devices sometimes (Di Shen)
- Simplify the thermal netlink API and clean up related code (Rafael
J. Wysocki)
- Make the Intel HFI driver support hibernation and deep suspend
properly (Ricardo Neri)"
* tag 'thermal-6.8-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/debugfs: Unlock on error path in thermal_debug_tz_trip_up()
thermal: intel: hfi: Add syscore callbacks for system-wide PM
thermal: gov_power_allocator: avoid inability to reset a cdev
thermal: helpers: Rearrange thermal_cdev_set_cur_state()
thermal: netlink: Rework notify API for cooling devices
thermal: core: Use kstrdup_const() during cooling device registration
thermal/debugfs: Add thermal debugfs information for mitigation episodes
thermal/debugfs: Add thermal cooling device debugfs information
thermal: netlink: Pass thermal zone pointer to notify routines
thermal: netlink: Drop thermal_notify_tz_trip_add/delete()
thermal: netlink: Pass pointers to thermal_notify_tz_trip_up/down()
thermal: netlink: Pass pointers to thermal_notify_tz_trip_change()
The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.
The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.
The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:
thermal/
-- cooling_devices
|-- 0
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 1
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 2
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 3
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
`-- 4
|-- clear
|-- time_in_state_ms
|-- total_trans
`-- trans_table
The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:
Transition Hits
1->0 246
0->1 246
2->1 632
1->2 632
3->2 98
2->3 98
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points. Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).
It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to four
sets of thermal control registers and one set of sampling register. The
sensor selector can selector a speific thermal sensor as temperature input.
The sampling register is used to obtain the temperature in real time, the
control register GATE field is used to set the threshold of high or low
temperature, when the input temperature is higher than the high temperature
threshold or lower than the low temperature threshold, an interrupt will
occur.
Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn>
Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn
The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.
Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge thermal control core changes for 6.3-rc1:
- Clean up thermal device unregistration code (Viresh Kumar).
- Fix and clean up thermal control core initialization error code
paths (Daniel Lezcano).
- Relocate the trip points handling code into a separate file (Daniel
Lezcano).
- Make the thermal core fail registration of thermal zones and cooling
devices if the thermal class has not been registered (Rafael Wysocki).
- Make the core thermal control code use sysfs_emit_at() instead of
scnprintf() where applicable (ye xingchen).
* thermal-core:
thermal: core: Use sysfs_emit_at() instead of scnprintf()
thermal: Fail object registration if thermal class is not registered
thermal/core: Move the thermal trip code to a dedicated file
thermal/core: Remove unneeded ida_destroy()
thermal/core: Fix unregistering netlink at thermal init time
thermal: core: Use device_unregister() instead of device_del/put()
thermal: core: Move cdev cleanup to thermal_release()
The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...
This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.
For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.
The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile
will not be included without QCOM_TSENS. This unnecessarily reduces
build coverage.
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Link: https://lore.kernel.org/r/20220821160032.2206349-1-jic23@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455
The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these register values when translating the Temperature
Monitor output codes to temperature values.
It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.
-40C to 30C
30C to 125C
125C to 150C
With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.
Tested temperature reading on J721e SoC & J7200 SoC.
[daniel.lezcano@linaro.org: Generate look-up tables run-time]
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.
The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.
The TSU has no interrupts as well as no external pins.
This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The zte zx platform is getting removed, so this driver is no
longer needed.
Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
The tango platform is getting removed, so the driver is no
longer needed.
Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
- Make better attempt at matching device with the correct OF node
- Allow batch removal of hierarchical sub-devices
- New Drivers
- Add STM32 Clocksource driver
- Add support for Khadas System Control Microcontroller
- Driver Removal
- Remove unused driver for TI's SMSC ECE1099
- New Device Support
- Add support for Intel Emmitsburg PCH to Intel LPSS PCI
- Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI
- Add support for Dialog DA revision to Dialog DA9063
- New Functionality
- Add support for AXP803 to be probed by I2C
- Fix-ups
- Numerous W=1 warning fixes
- Device Tree changes; stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller
- Enabled Regmap 'fast I/O'; stm32-lptimer
- Change BUG_ON to WARN_ON; arizona-core
- Remove superfluous code/initialisation; madera, max14577
- Trivial formatting/spelling issues; madera-core, madera-i2c, da9055, max77693-private
- Switch to of_platform_populate(); sprd-sc27xx-spi
- Expand out set/get brightness/pwm macros; lm3533-ctrlbank
- Disable IRQs on suspend; motorola-cpcap
- Clean-up error handling; intel_soc_pmic_mrfld
- Ensure correct removal order of sub-devices; madera
- Many s/HTTP/HTTPS/ link changes
- Ensure name used with Regmap is unique; syscon
- Bug Fixes
- Properly 'put' clock on unbind and error; arizona-core
- Fix revision handling; da9063
- Fix 'assignment of read-only location' error; kempld-core
- Avoid using the Regmap API when atomic; rn5t618
- Redefine volatile register description; rn5t618
- Use locking to protect event handler; dln2
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Merge tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd
Pull MFD updates from Lee Jones:
"Core Frameworks
- Make better attempt at matching device with the correct OF node
- Allow batch removal of hierarchical sub-devices
New Drivers
- Add STM32 Clocksource driver
- Add support for Khadas System Control Microcontroller
Driver Removal
- Remove unused driver for TI's SMSC ECE1099
New Device Support
- Add support for Intel Emmitsburg PCH to Intel LPSS PCI
- Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI
- Add support for Dialog DA revision to Dialog DA9063
New Functionality
- Add support for AXP803 to be probed by I2C
Fix-ups
- Numerous W=1 warning fixes
- Device Tree changes (stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller)
- Enabled Regmap 'fast I/O' in stm32-lptimer
- Change BUG_ON to WARN_ON in arizona-core
- Remove superfluous code/initialisation (madera, max14577)
- Trivial formatting/spelling issues (madera-core, madera-i2c, da9055, max77693-private)
- Switch to of_platform_populate() in sprd-sc27xx-spi
- Expand out set/get brightness/pwm macros in lm3533-ctrlbank
- Disable IRQs on suspend in motorola-cpcap
- Clean-up error handling in intel_soc_pmic_mrfld
- Ensure correct removal order of sub-devices in madera
- Many s/HTTP/HTTPS/ link changes
- Ensure name used with Regmap is unique in syscon
Bug Fixes
- Properly 'put' clock on unbind and error in arizona-core
- Fix revision handling in da9063
- Fix 'assignment of read-only location' error in kempld-core
- Avoid using the Regmap API when atomic in rn5t618
- Redefine volatile register description in rn5t618
- Use locking to protect event handler in dln2"
* tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (76 commits)
mfd: syscon: Use a unique name with regmap_config
mfd: Replace HTTP links with HTTPS ones
mfd: dln2: Run event handler loop under spinlock
mfd: madera: Improve handling of regulator unbinding
mfd: mfd-core: Add mechanism for removal of a subset of children
mfd: intel_soc_pmic_mrfld: Simplify the return expression of intel_scu_ipc_dev_iowrite8()
mfd: max14577: Remove redundant initialization of variable current_bits
mfd: rn5t618: Fix caching of battery related registers
mfd: max77693-private: Drop a duplicated word
mfd: da9055: pdata.h: Drop a duplicated word
mfd: rn5t618: Make restart handler atomic safe
mfd: kempld-core: Fix 'assignment of read-only location' error
mfd: axp20x: Allow the AXP803 to be probed by I2C
mfd: da9063: Add support for latest DA silicon revision
mfd: da9063: Fix revision handling to correctly select reg tables
dt-bindings: mfd: st,stmfx: Remove I2C unit name
dt-bindings: mfd: ti,j721e-system-controller.yaml: Add J721e system controller
mfd: motorola-cpcap: Disable interrupt for suspend
mfd: smsc-ece1099: Remove driver
mfd: core: Add OF_MFD_CELL_REG() helper
...
When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.
Fix this by adding a Kconfig option for the netlink notification,
defaulting to yes and depending on CONFIG_NET.
As the change implies multiple stubs and in order to not pollute the
internal thermal header, the thermal_nelink.h has been added and
included in the thermal_core.h, so this one regain some kind of
clarity.
Reported-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org
Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.
The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.
At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.
The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.
The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.
This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.
In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.
Also, a list of commands to discover the thermal setup is added and
can be extended when needed.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200706105538.2159-3-daniel.lezcano@linaro.org
The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.
This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..
This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
This patch adds the support for Spreadtrum thermal sensor controller,
which can support maximum 8 sensors.
Signed-off-by: Freeman Liu <freeman.liu@unisoc.com>
Co-developed-with: Baolin Wang <baolin.wang@unisoc.com>
Signed-off-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com
This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.
It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.
The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.
An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.
With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.
There is no functional changes.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).
The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.
Implement reading the temperature from each thermal sensor.
The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold
Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.
This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.
Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This cleans up the directory a bit allowing just one place to look for
thermal related drivers for QCOM platforms instead of being scattered in
the root directory and the qcom/ subdirectory. Compile-tested with
ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add support for DTS thermal sensor that can be
found on some STM32 platforms.
This driver is based on OF and works in interrupt
mode.
It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This branch contains platform-related driver updates for ARM and ARM64,
these are the areas that bring the changes:
New drivers:
- Driver support for Renesas R-Car V3M (R8A77970)
- Power management support for Amlogic GX
- A new driver for the Tegra BPMP thermal sensor
- A new bus driver for Technologic Systems NBUS
Changes for subsystems that prefer to merge through arm-soc:
- The usual updates for reset controller drivers from Philipp Zabel,
with five added drivers for SoCs in the arc, meson, socfpa, uniphier
and mediatek families.
- Updates to the ARM SCPI and PSCI frameworks, from Sudeep Holla,
Heiner Kallweit and Lorenzo Pieralisi.
Changes specific to some ARM-based SoC
- The Freescale/NXP DPAA QBMan drivers from PowerPC can now work
on ARM as well.
- Several changes for power management on Broadcom SoCs
- Various improvements on Qualcomm, Broadcom, Amlogic, Atmel, Mediatek
- Minor Cleanups for Samsung, TI OMAP SoCs
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Merge tag 'armsoc-drivers' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM SoC driver updates from Arnd Bergmann:
"This branch contains platform-related driver updates for ARM and
ARM64, these are the areas that bring the changes:
New drivers:
- driver support for Renesas R-Car V3M (R8A77970)
- power management support for Amlogic GX
- a new driver for the Tegra BPMP thermal sensor
- a new bus driver for Technologic Systems NBUS
Changes for subsystems that prefer to merge through arm-soc:
- the usual updates for reset controller drivers from Philipp Zabel,
with five added drivers for SoCs in the arc, meson, socfpa,
uniphier and mediatek families
- updates to the ARM SCPI and PSCI frameworks, from Sudeep Holla,
Heiner Kallweit and Lorenzo Pieralisi
Changes specific to some ARM-based SoC
- the Freescale/NXP DPAA QBMan drivers from PowerPC can now work on
ARM as well
- several changes for power management on Broadcom SoCs
- various improvements on Qualcomm, Broadcom, Amlogic, Atmel,
Mediatek
- minor Cleanups for Samsung, TI OMAP SoCs"
[ NOTE! This doesn't work without the previous ARM SoC device-tree pull,
because the R8A77970 driver is missing a header file that came from
that pull.
The fact that this got merged afterwards only fixes it at this point,
and bisection of that driver will fail if/when you walk into the
history of that driver. - Linus ]
* tag 'armsoc-drivers' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (96 commits)
soc: amlogic: meson-gx-pwrc-vpu: fix power-off when powered by bootloader
bus: add driver for the Technologic Systems NBUS
memory: omap-gpmc: Remove deprecated gpmc_update_nand_reg()
soc: qcom: remove unused label
soc: amlogic: gx pm domain: add PM and OF dependencies
drivers/firmware: psci_checker: Add missing destroy_timer_on_stack()
dt-bindings: power: add amlogic meson power domain bindings
soc: amlogic: add Meson GX VPU Domains driver
soc: qcom: Remote filesystem memory driver
dt-binding: soc: qcom: Add binding for rmtfs memory
of: reserved_mem: Accessor for acquiring reserved_mem
of/platform: Generalize /reserved-memory handling
soc: mediatek: pwrap: fix fatal compiler error
soc: mediatek: pwrap: fix compiler errors
arm64: mediatek: cleanup message for platform selection
soc: Allow test-building of MediaTek drivers
soc: mediatek: place Kconfig for all SoC drivers under menu
soc: mediatek: pwrap: add support for MT7622 SoC
soc: mediatek: pwrap: add common way for setup CS timing extenstion
soc: mediatek: pwrap: add MediaTek MT6380 as one slave of pwrap
..
Many source files in the tree are missing licensing information, which
makes it harder for compliance tools to determine the correct license.
By default all files without license information are under the default
license of the kernel, which is GPL version 2.
Update the files which contain no license information with the 'GPL-2.0'
SPDX license identifier. The SPDX identifier is a legally binding
shorthand, which can be used instead of the full boiler plate text.
This patch is based on work done by Thomas Gleixner and Kate Stewart and
Philippe Ombredanne.
How this work was done:
Patches were generated and checked against linux-4.14-rc6 for a subset of
the use cases:
- file had no licensing information it it.
- file was a */uapi/* one with no licensing information in it,
- file was a */uapi/* one with existing licensing information,
Further patches will be generated in subsequent months to fix up cases
where non-standard license headers were used, and references to license
had to be inferred by heuristics based on keywords.
The analysis to determine which SPDX License Identifier to be applied to
a file was done in a spreadsheet of side by side results from of the
output of two independent scanners (ScanCode & Windriver) producing SPDX
tag:value files created by Philippe Ombredanne. Philippe prepared the
base worksheet, and did an initial spot review of a few 1000 files.
The 4.13 kernel was the starting point of the analysis with 60,537 files
assessed. Kate Stewart did a file by file comparison of the scanner
results in the spreadsheet to determine which SPDX license identifier(s)
to be applied to the file. She confirmed any determination that was not
immediately clear with lawyers working with the Linux Foundation.
Criteria used to select files for SPDX license identifier tagging was:
- Files considered eligible had to be source code files.
- Make and config files were included as candidates if they contained >5
lines of source
- File already had some variant of a license header in it (even if <5
lines).
All documentation files were explicitly excluded.
The following heuristics were used to determine which SPDX license
identifiers to apply.
- when both scanners couldn't find any license traces, file was
considered to have no license information in it, and the top level
COPYING file license applied.
For non */uapi/* files that summary was:
SPDX license identifier # files
---------------------------------------------------|-------
GPL-2.0 11139
and resulted in the first patch in this series.
If that file was a */uapi/* path one, it was "GPL-2.0 WITH
Linux-syscall-note" otherwise it was "GPL-2.0". Results of that was:
SPDX license identifier # files
---------------------------------------------------|-------
GPL-2.0 WITH Linux-syscall-note 930
and resulted in the second patch in this series.
- if a file had some form of licensing information in it, and was one
of the */uapi/* ones, it was denoted with the Linux-syscall-note if
any GPL family license was found in the file or had no licensing in
it (per prior point). Results summary:
SPDX license identifier # files
---------------------------------------------------|------
GPL-2.0 WITH Linux-syscall-note 270
GPL-2.0+ WITH Linux-syscall-note 169
((GPL-2.0 WITH Linux-syscall-note) OR BSD-2-Clause) 21
((GPL-2.0 WITH Linux-syscall-note) OR BSD-3-Clause) 17
LGPL-2.1+ WITH Linux-syscall-note 15
GPL-1.0+ WITH Linux-syscall-note 14
((GPL-2.0+ WITH Linux-syscall-note) OR BSD-3-Clause) 5
LGPL-2.0+ WITH Linux-syscall-note 4
LGPL-2.1 WITH Linux-syscall-note 3
((GPL-2.0 WITH Linux-syscall-note) OR MIT) 3
((GPL-2.0 WITH Linux-syscall-note) AND MIT) 1
and that resulted in the third patch in this series.
- when the two scanners agreed on the detected license(s), that became
the concluded license(s).
- when there was disagreement between the two scanners (one detected a
license but the other didn't, or they both detected different
licenses) a manual inspection of the file occurred.
- In most cases a manual inspection of the information in the file
resulted in a clear resolution of the license that should apply (and
which scanner probably needed to revisit its heuristics).
- When it was not immediately clear, the license identifier was
confirmed with lawyers working with the Linux Foundation.
- If there was any question as to the appropriate license identifier,
the file was flagged for further research and to be revisited later
in time.
In total, over 70 hours of logged manual review was done on the
spreadsheet to determine the SPDX license identifiers to apply to the
source files by Kate, Philippe, Thomas and, in some cases, confirmation
by lawyers working with the Linux Foundation.
Kate also obtained a third independent scan of the 4.13 code base from
FOSSology, and compared selected files where the other two scanners
disagreed against that SPDX file, to see if there was new insights. The
Windriver scanner is based on an older version of FOSSology in part, so
they are related.
Thomas did random spot checks in about 500 files from the spreadsheets
for the uapi headers and agreed with SPDX license identifier in the
files he inspected. For the non-uapi files Thomas did random spot checks
in about 15000 files.
In initial set of patches against 4.14-rc6, 3 files were found to have
copy/paste license identifier errors, and have been fixed to reflect the
correct identifier.
Additionally Philippe spent 10 hours this week doing a detailed manual
inspection and review of the 12,461 patched files from the initial patch
version early this week with:
- a full scancode scan run, collecting the matched texts, detected
license ids and scores
- reviewing anything where there was a license detected (about 500+
files) to ensure that the applied SPDX license was correct
- reviewing anything where there was no detection but the patch license
was not GPL-2.0 WITH Linux-syscall-note to ensure that the applied
SPDX license was correct
This produced a worksheet with 20 files needing minor correction. This
worksheet was then exported into 3 different .csv files for the
different types of files to be modified.
These .csv files were then reviewed by Greg. Thomas wrote a script to
parse the csv files and add the proper SPDX tag to the file, in the
format that the file expected. This script was further refined by Greg
based on the output to detect more types of files automatically and to
distinguish between header and source .c files (which need different
comment types.) Finally Greg ran the script using the .csv files to
generate the patches.
Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Philippe Ombredanne <pombredanne@nexb.com>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
On Tegra186, the BPMP (Boot and Power Management Processor) exposes an
interface to thermal sensors on the system-on-chip. This driver
implements access to the interface. It supports reading the
temperature, setting trip points and receiving notification of a
tripped trip point.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Fix a problem where orderly_shutdown() is called for multiple times
due to multiple critical overheating events raised in a short period
by platform thermal driver. (Keerthy)
- Introduce a backup thermal shutdown mechanism, which invokes
kernel_power_off()/emergency_restart() directly, after
orderly_shutdown() being issued for certain amount of time(specified
via Kconfig). This is useful in certain conditions that userspace may
be unable to power off the system in a clean manner and leaves the
system in a critical state, like in the middle of driver probing
phase. (Keerthy)
- Introduce a new interface in thermal devfreq_cooling code so that the
driver can provide more precise data regarding actual power to the
thermal governor every time the power budget is calculated. (Lukasz
Luba)
- Introduce BCM 2835 soc thermal driver and northstar thermal driver,
within a new sub-folder. (Rafał Miłecki)
- Introduce DA9062/61 thermal driver. (Steve Twiss)
- Remove non-DT booting on TI-SoC driver. Also add support to fetching
coefficients from DT. (Keerthy)
- Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)
- Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
Brian Bian)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: core: Add a back up thermal shutdown mechanism
thermal: core: Allow orderly_poweroff to be called only once
Thermal: Intel SoC DTS: Change interrupt request behavior
trace: thermal: add another parameter 'power' to the tracing function
thermal: devfreq_cooling: add new interface for direct power read
thermal: devfreq_cooling: refactor code and add get_voltage function
thermal: mt8173: minor mtk_thermal.c cleanups
thermal: bcm2835: move to the broadcom subdirectory
thermal: broadcom: ns: specify myself as MODULE_AUTHOR
thermal: da9062/61: Thermal junction temperature monitoring driver
Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
thermal: broadcom: add Northstar thermal driver
dt-bindings: thermal: add support for Broadcom's Northstar thermal
thermal: bcm2835: add thermal driver for bcm2835 SoC
dt-bindings: Add thermal zone to bcm2835-thermal example
thermal: rcar_gen3_thermal: add suspend and resume support
thermal: rcar_gen3_thermal: store device match data in private structure
thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
thermal: rcar_gen3_thermal: record and check number of TSCs found
thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
...
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.
If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.
The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).
This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.
When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.
This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add basic thermal driver for bcm2835 SoC.
This driver currently make sure that tsense HW block is set up
correctly.
Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.
The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.
Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.
Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Here we have a simple code organization. This patch moves
functions that do not need to handle thermal core internal
data structure to thermal_helpers.c file.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This is a code reorganization, simply to concentrate
the code handling sysfs in a specific file: thermal_sysfs.c.
Right now, moving only the sysfs entries of thermal_zone_device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
