The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-4-frank.li@vivo.com
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add iMX8QM sensors. As stated in 31fd4b9db1 ("thermal/drivers/imx_sc:
Rely on the platform data to get the resource id"):
The thermal OF code returns -ENODEV if the thermal zone registration
with a specific id fails because the description is not available in
the DT for such a sensor id. In this case we continue with the other
ids without bailing out with an error.
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-2-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The minimal resource ID is 0: IMX_SC_R_AP_0=0, so fix
the loop condition. Aside of this - constify the array.
Fixes: 31fd4b9db1 ("thermal/drivers/imx_sc: Rely on the platform data to get the resource id")
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <Aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-1-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Currently the imx_sc driver is reimplementing part of the thermal zone
parsing from the thermal OF tree code to get the sensor id associated
with a thermal zone sensor.
The driver platform specific code should know what sensor is present
and not rely on the thermal zone description to do a discovery. Well
that is arguable but all the other drivers have a per platform data
telling what sensor id to use.
The imx_sc thermal driver is the only one using a different
approach. Not invalid but forcing to keep a specific function
'thermal_zone_of_get_sensor_id()' to get the sensor id for a specific
thermal zone as the self-explanatory function tells and having device
tree code inside the driver.
The thermal OF code had a rework and remains now self-encapsulated
with a register/unregister functions and their 'devm' variants, except
for the function mentioned above.
After investigating, it appears the imx_sc sensor is defined in
arch/arm64/boot/dts/freescale/imx8qxp.dtsi:
which defines the cpu-thermal zone with the id: IMX_SC_R_SYSTEM
This dtsi is included by:
- imx8qxp-ai_ml.dts
- imx8qxp-colibri.dtsi
- imx8qxp-mek.dts
The two first ones do not define more thermal zones
The third one adds the pmic-thermal0 zone with id: IMX_SC_R_PMIC_0
The thermal OF code returns -ENODEV if the thermal zone registration
with a specific id fails because the description is not available in
the DT for such a sensor id. In this case we continue with the other
ids without bailing out with an error.
So we can build for the 'fsl,imx-sc-thermal' a compatible data, an
array of sensor ids containing IMX_SC_R_SYSTEM and IMX_SC_R_PMIC_0.
The latter won't be found but that will not result in an error but a
normal case where we continue the initialization with other ids.
Just to clarify, it is what the thermal framework does and what the
other drivers are expecting: when a registration fails with -ENODEV
this is not an error but a case where the description is not found in
the device tree, that be can the entire thermal zones description or a
specific thermal zone with an unknown id.
There is one small functional change but without impact. When there is
no 'thermal-zones' description the probe function was returning
'-ENODEV', now it returns zero. When a thermal zone fails to register
with an error different from '-ENODEV', the error is detected and
returned.
Change the code accordingly and remove the OF code from the driver.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220818082316.2717095-1-daniel.lezcano@linaro.org
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-17-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
of_find_node_by_name() returns a node pointer with refcount
incremented, we should use of_node_put() on it when done.
Add missing of_node_put() to avoid refcount leak.
Fixes: e20db70dba ("thermal: imx_sc: add i.MX system controller thermal support")
Signed-off-by: Miaoqian Lin <linmq006@gmail.com>
Link: https://lore.kernel.org/r/20220517055121.18092-1-linmq006@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Early exits from for_each_available_child_of_node() should decrement the
node reference counter. Reported by Coccinelle:
drivers/thermal/imx_sc_thermal.c:93:1-33: WARNING:
Function "for_each_available_child_of_node" should have of_node_put() before return around line 97.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210614192230.19248-1-krzysztof.kozlowski@canonical.com
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device (Matthias
Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error handling
(Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC
thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the change
the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace module.h by
export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal driver
(Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the int340x
thermal driver - trivial conflicts fixed (Matthew Garrett)
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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
i.MX8 SoCs DTS file needs system control macro definitions, so move them
into dt-binding headfile, then include/linux/firmware/imx/types.h can be
removed and those drivers using it should be changed accordingly.
Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
The temperature value passed from SCU could be negative value,
the data type should be signed instead of unsigned.
Fixes: e20db70dba ("thermal: imx_sc: add i.MX system controller thermal support")
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1584606380-9972-1-git-send-email-Anson.Huang@nxp.com
The i.MX SCU API strongly assumes that messages are composed out
of 4-bytes words but some of our message structs have odd sizeofs,
use __packed __aligned(4) to avoid potential oopses.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583117485-30922-1-git-send-email-Anson.Huang@nxp.com
i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..
This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com