Commit Graph

12 Commits

Author SHA1 Message Date
Thierry Reding
5368084c39 thermal/drivers/max77620: Remove duplicate error message
The thermal_of_zone_register() function already prints an error message
when appropriate, so remove the extra one from the MAX77620 thermal
driver.

This fixes a spurious error message when no thermal zone was defined
for the MAX77620 in device tree.

Reported-by: Nicolas Chauvet <kwizart@gmail.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231013155104.1781197-1-thierry.reding@gmail.com
2023-10-15 23:40:10 +02:00
Andrei Coardos
72449b3a21 thermal/drivers/max77620_thermal: Removed unneeded call to platform_set_drvdata()
This function call was found to be unnecessary as there is no equivalent
platform_get_drvdata() call to access the private data of the driver. Also,
the private data is defined in this driver, so there is no risk of it being
accessed outside of this driver file.

Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com>
Reviewed-by: Alexandru Ardelean <alex@shruggie.ro>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230811191548.3340-1-aboutphysycs@gmail.com
2023-08-16 12:33:53 +02:00
Daniel Lezcano
abda7383ec thermal: Remove debug or error messages in get_temp() ops
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.

The debug message is already displayed from the call site of this
ops. So we can remove it.

On the other side, the error should not be displayed because in
production that can raise tons of messages.

Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.

Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.

Remove those messages.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano
5f68d0785e thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Use the devdata accessor introduced in the previous patch.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>  #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano
ae11d6a87c thermal/drivers/maxim: Switch to new of API
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.

Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-23-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-08-17 14:09:38 +02:00
Amit Kucheria
0f43e646dd thermal: max77620: Appease the kernel-doc deity
Fix up the following warning when compiled with make W=1:

linux.git/drivers/thermal/max77620_thermal.c:48: warning: Function
parameter or member 'temp' not described in 'max77620_thermal_read_temp'

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/c943d51e7913a4b73cda447547b8ee77c857f7ba.1574242756.git.amit.kucheria@linaro.org
2020-01-27 10:24:32 +01:00
Thomas Gleixner
75a6faf617 treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 422
Based on 1 normalized pattern(s):

  this program is free software you can redistribute it and or modify
  it under the terms and conditions of the gnu general public license
  version 2 as published by the free software foundation

extracted by the scancode license scanner the SPDX license identifier

  GPL-2.0-only

has been chosen to replace the boilerplate/reference in 101 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190531190113.822954939@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-06-05 17:37:15 +02:00
Johan Hovold
ce046e5d9b thermal: max77620: fix pinmux conflict on reprobe
Use the new helper for reusing a device-tree node of another device
instead of managing the node references explicitly.

This also makes sure that the new of_node_reuse flag is set if the
device is ever reprobed, something which specifically now avoids driver
core from attempting to claim any pinmux resources already claimed by
the parent device.

Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-06-13 11:07:32 +02:00
Johan Hovold
c592fafbdb thermal: max77620: fix device-node reference imbalance
The thermal child device reuses the parent MFD-device device-tree node
when registering a thermal zone, but did not take a reference to the
node.

This leads to a reference imbalance, and potential use-after-free, when
the node reference is dropped by the platform-bus device destructor
(once for the child and later again for the parent).

Fix this by dropping any reference already held to a device-tree node
and getting a reference to the parent's node which will be balanced on
reprobe or on platform-device release, whichever comes first.

Note that simply clearing the of_node pointer on probe errors and on
driver unbind would not allow the use of device-managed resources as
specifically thermal_zone_of_sensor_unregister() claims that a valid
device-tree node pointer is needed during deregistration (even if it
currently does not seem to use it).

Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: stable <stable@vger.kernel.org>     # 4.9
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-06-13 11:07:32 +02:00
Javier Martinez Canillas
3f2883e5bf thermal: max77620: Fix module autoload
If the driver is built as a module, autoload won't work because the module
alias information is not filled. So user-space can't match the registered
device with the corresponding module.

Export the module alias information using the MODULE_DEVICE_TABLE() macro.

Before this patch:

$ modinfo drivers/thermal/max77620_thermal.ko | grep alias
$

After this patch:

$ modinfo drivers/thermal/max77620_thermal.ko | grep alias
alias:          platform:max77620-thermal

Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-11-23 10:07:35 +08:00
Srinivas Pandruvada
0e70f466fb thermal: Enhance thermal_zone_device_update for events
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:35:21 +08:00
Laxman Dewangan
ec4664b3fd thermal: max77620: Add thermal driver for reporting junction temp
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00