Commit Graph

2384 Commits

Author SHA1 Message Date
Linus Torvalds
11c7052998 ARM: SoC drivers for 6.3
As usual, there are lots of minor driver changes across SoC platforms
 from  NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
 These usually add support for additional chip variations in existing
 drivers, but also add features or bugfixes.
 
 The SCMI firmware subsystem gains a unified raw userspace interface
 through debugfs, which can be used for validation purposes.
 
 Newly added drivers include:
 
  - New power management drivers for StarFive JH7110, Allwinner D1 and
    Renesas RZ/V2M
 
  - A driver for Qualcomm battery and power supply status
 
  - A SoC device driver for identifying Nuvoton WPCM450 chips
 
  - A regulator coupler driver for Mediatek MT81xxv
 -----BEGIN PGP SIGNATURE-----
 
 iQIzBAABCgAdFiEEo6/YBQwIrVS28WGKmmx57+YAGNkFAmPtSN8ACgkQmmx57+YA
 GNkOSw/+JS5tElm/ZP7c3uWYp6uwvcb0jUlKW/U3aCtPiPEcYDLEqIEXwcNdaDMh
 m4rW3GYlW0IRL3FsyuYkSLx+EIIUIfs40wldYXJOqRDj0XasndiloIwltOQJGfd9
 C/UVM0FpJdxMJrcBMFgwLLQCIbAVnhHP34i6ppDRgxW/MfTeiCaaG6fnS70iv6mC
 oh2N7FoZSKDtTrFtlR5TqFiK5v/W1CgNJVuglkFB0ceFpjyBpp/8AT0FGS887xCz
 IYSTqm4Q/79vaZXI1Y2oog257cgdwsVqgPrnK5CuSFhTnAcJMCekiFelHq8Yhyuk
 Rw7j/B3KO3AOaxmR75c6SZdeZ+VHgUMRC/RKe3fay0sm3Zea2kAIPXA6Zn+r/cxb
 8M94V59qBz+f8XmpXRTK1UR3s3EbwFIuNyuDIkeorMtpSKtvqJXmZxGDwNIfXr2F
 /voo++MKjzdtdxdW/D/5Tc9DC0Pyb4HLi0EYj2QCzA03njmfLDF1w73NfzMec+GD
 R1zAd3FEbiJQx8Hin0PSPjYXpfMnkjkGAEcE9N9Ralg4ewNWAxfOFsAhHKTZNssL
 pitTAvHR/+dXtvkX7FUi2l/6fqn8nJUrg/xRazPPp3scRbpuk8m6P4MNr3/lsaHk
 HTQ/hYwDdecWLvKXjw5y9yIr3yhLmPPcloTVIIFFjsM0t8b+d9E=
 =p6Xp
 -----END PGP SIGNATURE-----

Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

Pull ARM SoC driver updates from Arnd Bergmann:
 "As usual, there are lots of minor driver changes across SoC platforms
  from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
  These usually add support for additional chip variations in existing
  drivers, but also add features or bugfixes.

  The SCMI firmware subsystem gains a unified raw userspace interface
  through debugfs, which can be used for validation purposes.

  Newly added drivers include:

   - New power management drivers for StarFive JH7110, Allwinner D1 and
     Renesas RZ/V2M

   - A driver for Qualcomm battery and power supply status

   - A SoC device driver for identifying Nuvoton WPCM450 chips

   - A regulator coupler driver for Mediatek MT81xxv"

* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
  power: supply: Introduce Qualcomm PMIC GLINK power supply
  soc: apple: rtkit: Do not copy the reg state structure to the stack
  soc: sunxi: SUN20I_PPU should depend on PM
  memory: renesas-rpc-if: Remove redundant division of dummy
  soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
  dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
  dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
  firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
  MAINTAINERS: Update qcom CPR maintainer entry
  dt-bindings: firmware: document Qualcomm SM8550 SCM
  dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
  soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
  dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
  soc: qcom: socinfo: Add support for new field in revision 17
  soc: qcom: smd-rpm: Add IPQ9574 compatible
  soc: qcom: pmic_glink: remove redundant calculation of svid
  soc: qcom: stats: Populate all subsystem debugfs files
  dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
  soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
  soc: qcom: pmic_glink: Introduce altmode support
  ...
2023-02-27 10:04:49 -08:00
Alain Volmat
6828e402d0 thermal/drivers/st: Remove syscfg based driver
The syscfg based thermal driver is only supporting STiH415 STiH416 and
STiD127 platforms which are all no more supported.  We can thus safely
remove this driver since the remaining STi platform STiH407/STiH410
and STiH418 are all using the memmap based thermal driver.

Signed-off-by: Alain Volmat <avolmat@me.com>
Link: https://lore.kernel.org/r/20230209091659.1409-7-avolmat@me.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:30:04 +01:00
Daniel Lezcano
9272d2d43b thermal: Remove core header inclusion from drivers
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.

Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.

Remove this inclusion in every place where it is possible.

Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.

The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.

The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:48 +01:00
Yongqin Liu
15cc25829a thermal/drivers/hisi: Drop second sensor hi3660
The commit 74c8e6bffb ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.

Fix this by removing the unneeded second access.

Fixes: 7d3a2a2bba ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:33 +01:00
Niklas Söderlund
47b2d3d2ed thermal/drivers/rcar_gen3_thermal: Fix device initialization
The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.

The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.

Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:23 +01:00
Niklas Söderlund
aef43e0493 thermal/drivers/rcar_gen3_thermal: Create device local ops struct
The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.

Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:15 +01:00
Niklas Söderlund
1c63f8cd01 thermal/drivers/rcar_gen3_thermal: Do not call set_trips() when resuming
There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.

Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:07 +01:00
Geert Uytterhoeven
883d155299 thermal/drivers/rcar_gen3: Add support for R-Car V4H
Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.

According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:28:58 +01:00
Balsam CHIHI
f5f633b182 thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver
The Low Voltage Thermal Sensor (LVTS) is a multiple sensors, multi
controllers contained in a thermal domain.

A thermal domains can be the MCU or the AP.

Each thermal domains contain up to seven controllers, each thermal
controller handle up to four thermal sensors.

The LVTS has two Finite State Machines (FSM), one to handle the
functionin temperatures range like hot or cold temperature and another
one to handle monitoring trip point. The FSM notifies via interrupts
when a trip point is crossed.

The interrupt is managed at the thermal controller level, so when an
interrupt occurs, the driver has to find out which sensor triggered
such an interrupt.

The sampling of the thermal can be filtered or immediate. For the
former, the LVTS measures several points and applies a low pass
filter.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>

On MT8195 Tomato Chromebook:

Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-5-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:28:42 +01:00
Balsam CHIHI
fad399ebdd thermal/drivers/mediatek: Relocate driver to mediatek folder
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:28:25 +01:00
Rafael J. Wysocki
badf1f9050 Merge branch 'thermal-intel'
Merge thermal control changes related to Intel platforms for 6.3-rc1:

 - Rework ACPI helper functions for thermal control to retrieve a trip
   point temperature instead of initializing a trip point objetc (Rafael
   Wysocki).

 - Clean up and improve the int340x thermal driver ((Rafael Wysocki).

 - Simplify and clean up the intel_pch thermal driver ((Rafael Wysocki).

 - Fix the Intel powerclamp thermal driver and make it use the common
   idle injection framework (Srinivas Pandruvada).

 - Add two module parameters, cpumask and max_idle, to the Intel powerclamp
   thermal driver to allow it to affect only a specific subset of CPUs
   instead of all of them (Srinivas Pandruvada).

 - Make the Intel quark_dts thermal driver Use generic trip point
   objects instead of its own trip point representation (Daniel
   Lezcano).

 - Add toctree entry for thermal documents and fix two issues in the
   Intel powerclamp driver documentation (Bagas Sanjaya).

* thermal-intel: (25 commits)
  Documentation: powerclamp: Fix numbered lists formatting
  Documentation: powerclamp: Escape wildcard in cpumask description
  Documentation: admin-guide: Add toctree entry for thermal docs
  thermal: intel: powerclamp: Add two module parameters
  Documentation: admin-guide: Move intel_powerclamp documentation
  thermal: intel: powerclamp: Fix duration module parameter
  thermal: intel: powerclamp: Return last requested state as cur_state
  thermal: intel: quark_dts: Use generic trip points
  thermal: intel: powerclamp: Use powercap idle-inject feature
  powercap: idle_inject: Add update callback
  powercap: idle_inject: Export symbols
  thermal: intel: powerclamp: Fix cur_state for multi package system
  thermal: intel: intel_pch: Drop struct board_info
  thermal: intel: intel_pch: Rename board ID symbols
  thermal: intel: intel_pch: Fold suspend and resume routines into their callers
  thermal: intel: intel_pch: Fold two functions into their callers
  thermal: intel: intel_pch: Eliminate device operations object
  thermal: intel: intel_pch: Rename device operations callbacks
  thermal: intel: intel_pch: Eliminate redundant return pointers
  thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
  ...
2023-02-15 17:18:08 +01:00
Rafael J. Wysocki
c3bd6d539f Merge branch 'thermal-core'
Merge thermal control core changes for 6.3-rc1:

 - Clean up thermal device unregistration code (Viresh Kumar).

 - Fix and clean up thermal control core initialization error code
   paths (Daniel Lezcano).

 - Relocate the trip points handling code into a separate file (Daniel
   Lezcano).

 - Make the thermal core fail registration of thermal zones and cooling
   devices if the thermal class has not been registered (Rafael Wysocki).

 - Make the core thermal control code use sysfs_emit_at() instead of
   scnprintf() where applicable (ye xingchen).

* thermal-core:
  thermal: core: Use sysfs_emit_at() instead of scnprintf()
  thermal: Fail object registration if thermal class is not registered
  thermal/core: Move the thermal trip code to a dedicated file
  thermal/core: Remove unneeded ida_destroy()
  thermal/core: Fix unregistering netlink at thermal init time
  thermal: core: Use device_unregister() instead of device_del/put()
  thermal: core: Move cdev cleanup to thermal_release()
2023-02-15 17:08:30 +01:00
Arnd Bergmann
68907175ec More Qualcomm driver updates for 6.3
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
 Qualcomm-specific files directly in include/linux.
 
 Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
 provides an interface to the firmware implementing battery management
 and USB Type-C handling. Together with the base driver comes the custom
 altmode support driver.
 
 SMD RPM gains support for IPQ9574, and socinfo is extended with support
 for revision 17 of the information format and soc_id for IPQ5332 and
 IPQ8064 are added.
 
 The qcom_stats  is changes not to fail when not all parts are
 initialized.
 -----BEGIN PGP SIGNATURE-----
 
 iQJJBAABCAAzFiEEBd4DzF816k8JZtUlCx85Pw2ZrcUFAmPmiz4VHGFuZGVyc3Nv
 bkBrZXJuZWwub3JnAAoJEAsfOT8Nma3FMZ8QANXJEr7U2KX/yd4riBju6Btn0unl
 I8TR5XlaQAoBUbyp4yTcCUfCe0mEiNcE/YgJwzSKY3mNxc9vLhn1GgqdF+5RFTZw
 0H8GBjUpQiRoCC2+pq3YCEisQ49HYXy9W3ys6t1Y3l8xUDLhw5CkeKOGQCqeBDX7
 pCflPy7HFUQwPhGt7AOmpNj8+Kh4GnpJHF3D2ShAMFNOn4+l0v8Gh7zDw62FmhBg
 gjA7eS2aZS7KmqEJMAC4dEFdmhvvN+a80KaWNOOQn2sdLtD64pRW2hknxinPRN+t
 dGQKeD+VGFHLfxWO40Lv0nP8P/EWjXiZdhO8HXLmVjHC56G/MG8AW0BkvxW9jPAa
 QGlzY0TbEbi0MbbAnyCJTy6USGtVUZbEmfcZ8r3rUJX5xO8eszSjueD6fH/nKIgo
 hDIIG8nSLf5TCY+NJzGr8dKENiElsgsfdNAypoX6kpXCRUCXxkiKlWzy/3oywVcO
 bKm5xs76YNNaANFf46oO6kts7nrOcegyTAdvauFemy1Q3KSWQuFP4jNpcRvWnVMN
 8/BlQ+a5uGofN/wwHS2CPmE1r8njEqlPc7wWNc0ugoRO4kAUtB2UldjjS/ZfaFvH
 BZiDDXhjScPj8lKk4kzGOb34W5AKkwFbTwSR1oN0ckW9UNDx51pNu72YlU8WLydV
 VHmzD9ndTkWSmp7W
 =+KgT
 -----END PGP SIGNATURE-----
gpgsig -----BEGIN PGP SIGNATURE-----
 
 iQIzBAABCgAdFiEEo6/YBQwIrVS28WGKmmx57+YAGNkFAmPqVbkACgkQmmx57+YA
 GNnlFRAAuaoe9/7kOAliVks4vkJ8284POk50kuS5llzNAP4BPsQIJakE6dOOiTY1
 01qbvTlu5pK+f2ls+3WQYr5Rhgck4BUEFD+t9WcPtOpB1uq0puyWj3fwuErjDFJv
 S6nKp2P0tpru5VzQFPROyrBCw5Zlkc0U9FID4P1Ub5ulxxDWJ4ODb9Q+C9DtDxJo
 HuUGRnGPLmAJd4ymKzCtnqcg3gocFdrl9K+msFuJwAgdZ0xB893l3wyOFn2k97Uh
 8m8WEI/NbCTfDEjag3+yx9Sl3rZhtav0EnlIqowBHQFvxFaBDnvW6H4QmNRugAog
 +kH1hVzojj35jDllwL07OJzdjqW497Z9i+MEGz45h/8FvvdqJ+71UTkOwr+vnWKu
 zuEzEfM+bB434UBCQihJ7emx7eCac3TP3Von/NigDDBIXDu8iqNgUNmB8eNyN+gJ
 Db1mdatG4TuSEqnzetX4XKLP3eydxG8lkEZDOcWlhRz8CSWx9KkBU7W+hVNCBLdV
 kdhjvZpb5cRcqc/KsS22hmB3HIoISGkLrBOvqs375+Sg9PFxBGst+q24kf9MEDFz
 ypj/CRiMzkNq8IBwGF003CVhDHmlloq2afQ7YX0w1sEE0XOCIDE0YWNNb9fcoTAC
 MeDL9R4VgfjR/8Bj7zgnYOMAt6hRoHXsZ1gtS29doIH5iLdTXVI=
 =8eLr
 -----END PGP SIGNATURE-----

Merge tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux into soc/drivers

More Qualcomm driver updates for 6.3

The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.

Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.

SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.

The qcom_stats  is changes not to fail when not all parts are
initialized.

* tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux:
  soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
  dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
  dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
  firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
  MAINTAINERS: Update qcom CPR maintainer entry
  dt-bindings: firmware: document Qualcomm SM8550 SCM
  dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
  soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
  dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
  soc: qcom: socinfo: Add support for new field in revision 17
  soc: qcom: smd-rpm: Add IPQ9574 compatible
  soc: qcom: pmic_glink: remove redundant calculation of svid
  soc: qcom: stats: Populate all subsystem debugfs files
  dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
  soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
  soc: qcom: pmic_glink: Introduce altmode support
  soc: qcom: pmic_glink: Introduce base PMIC GLINK driver
  dt-bindings: soc: qcom: Introduce PMIC GLINK binding
  soc: qcom: dcc: Drop driver for now

Link: https://lore.kernel.org/r/20230210182242.2023901-1-andersson@kernel.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
2023-02-13 16:22:33 +01:00
Srinivas Pandruvada
ebf5197102 thermal: intel: powerclamp: Add two module parameters
In some use cases, it is desirable to only inject idle on certain set
of CPUs. For example on Alder Lake systems, it is possible that we force
idle only on P-Cores for thermal reasons. Also the idle percent can be
more than 50% if we only choose partial set of CPUs in the system.

Introduce 2 new module parameters for this purpose. They can be only
changed when the cooling device is inactive.

cpumask (Read/Write): A bit mask of CPUs to inject idle. The format of
this bitmask is same as used in other subsystems like in
/proc/irq/*/smp_affinity. The mask is comma separated 32 bit groups.
Each CPU is one bit. For example for 256 CPU system the full mask is:
ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff
The rightmost mask is for CPU 0-32.

max_idle (Read/Write): Maximum injected idle time to the total CPU time
ratio in percent range from 1 to 100. Even if the cooling device max_state
is always 100 (100%), this parameter allows to add a max idle percent
limit. The default is 50, to match the current implementation of powerclamp
driver. Also doesn't allow value more than 75, if the cpumask includes
every CPU present in the system.

Also when the cpumask doesn't include every CPU, there is no use of
compensation using package C-state idle counters. Hence don't start
package C-state polling thread even for a single package or a single die
system in this case.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 21:01:06 +01:00
ye xingchen
5bbafd4362 thermal: core: Use sysfs_emit_at() instead of scnprintf()
Follow the advice in Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.

Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 20:39:48 +01:00
Srinivas Pandruvada
966d0ab673 thermal: intel: powerclamp: Fix duration module parameter
After the switch to use the powercap/idle-inject framework in the Intel
powerclamp driver, the idle duration unit is microsecond.

However, the module parameter for idle duration is in milliseconds, so
convert it to microseconds in the "set" callback and back to milliseconds
in a new "get" callback.

While here, also use mutex protection for setting and getting "duration".

The other uses of "duration" are already protected by the mutex.

Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 19:57:35 +01:00
Elliot Berman
3bf90eca76 firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h.
This removes 1 of a few remaining Qualcomm-specific headers into a more
approciate subdirectory under include/.

Suggested-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Elliot Berman <quic_eberman@quicinc.com>
Reviewed-by: Guru Das Srinagesh <quic_gurus@quicinc.com>
Acked-by: Mukesh Ojha <quic_mojha@quicinc.com>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com
2023-02-08 19:15:16 -08:00
Srinivas Pandruvada
6210849654 thermal: intel: powerclamp: Return last requested state as cur_state
When the user is reading cur_state from the thermal cooling device for
Intel powerclamp device:
 - It returns the idle ratio from Package C-state counters when
   there is active idle injection session.
 - -1, when there is no active idle injection session.

This information is not very useful as the package C-state counters vary
a lot from read to read. Instead just return the last requested cur_state.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-07 20:51:15 +01:00
Daniel Lezcano
72ffc28f2f thermal: intel: quark_dts: Use generic trip points
Make the intel_quark_dts_thermal driver register an array of generic
trip points along with the thermal zone and drop the trip points
thermal zone callbacks that are not used any more from it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-03 14:49:26 +01:00
Srinivas Pandruvada
8526eb7fc7 thermal: intel: powerclamp: Use powercap idle-inject feature
There are two idle injection implementation in the Linux kernel. One
via intel_powerclamp and the other using powercap/idle_inject. Both
implementation end up in calling play_idle* function from a FIFO
priority thread. Both can't be used at the same time.

It is better to use one idle injection framework for better
maintainability. In this way, there is only one caller for play_idle.

Here powercap/idle_inject can be used for both per-core and for system
wide idle injection. This framework has a well defined interface which
allow registry for per-core or for all CPUs (system wide).

This reduces code complexity in the intel powerclamp driver as all the
per CPU kthreads, delayed work and calls to play_idle can be removed.

The changes include:
 - Remove unneeded include files
 - Remove per CPU kthread workers: balancing_work and idle_injection_work.
 - Reuse the compensation related code by moving from previous worker
   thread to idle_injection callback.
 - Adjust the idle_duration and runtime by using powercap/idle_inject
   interface.
 - Remove all variables, which are not required once powercap/idle_inject
   is used.
 - Add mutex to avoid race during removal of idle injection during module
   unload and user action to change idle inject percent. Also for
   protection during dynamic adjustment of run and idle time from
   update() callback.
 - Remove online/offline callbacks to designate control CPU
 - Use cpu_present_mask global variable for CPU mask
 - Remove hot plug locks

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-03 14:48:34 +01:00
Srinivas Pandruvada
8e47363588 thermal: intel: powerclamp: Fix cur_state for multi package system
The powerclamp cooling device cur_state shows actual idle observed by
package C-state idle counters. But the implementation is not sufficient
for multi package or multi die system. The cur_state value is incorrect.
On these systems, these counters must be read from each package/die and
somehow aggregate them. But there is no good method for aggregation.

It was not a problem when explicit CPU model addition was required to
enable intel powerclamp. In this way certain CPU models could have
been avoided. But with the removal of CPU model check with the
availability of Package C-state counters, the driver is loaded on most
of the recent systems.

For multi package/die systems, just show the actual target idle state,
the system is trying to achieve. In powerclamp this is the user set
state minus one.

Also there is no use of starting a worker thread for polling package
C-state counters and applying any compensation for multiple package
or multiple die systems.

Fixes: b721ca0d19 ("thermal/powerclamp: remove cpu whitelist")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 4.14+ <stable@vger.kernel.org> # 4.14+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-02 21:08:32 +01:00
Rafael J. Wysocki
2153a87ff9 thermal: intel: intel_pch: Drop struct board_info
Because the only member of struct board_info is the name, the
board_info[] array of struct board_info elements can be replaced with
an array of strings.

Modify the code accordingly and drop struct board_info.

No intentional functional impact.

Suggested-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:06:24 +01:00
Rafael J. Wysocki
ae98e57a6e thermal: intel: intel_pch: Rename board ID symbols
Use capitals in the names of the board ID symbols and add the PCH_
prefix to each of them for consistency.

Also rename the board_ids enum accordingly.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:06:15 +01:00
Rafael J. Wysocki
c5f43242f4 thermal: intel: intel_pch: Fold suspend and resume routines into their callers
Fold pch_suspend() and pch_resume(), that each have only one caller,
into their respective callers to make the code somewhat easier to
follow.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:06:09 +01:00
Rafael J. Wysocki
35c87f948d thermal: intel: intel_pch: Fold two functions into their callers
Fold two functions, pch_hw_init() and pch_get_temp(), that each have
only one caller, into their respective callers to make the code somewhat
easier to follow.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:04:01 +01:00
Rafael J. Wysocki
86cb1004b6 thermal: intel: intel_pch: Eliminate device operations object
The same device operations object is pointed to by all of the board
configurations in the driver, so effectively the same operations
callbacks are used by all of them which only adds overhead (that can
be significant due to retpolines) for no real purpose.

For this reason, drop the device operations object and replace the
respective callback invocations by direct calls to the specific
functions that were previously pointed to by callback pointers.

No intentional change in behavior.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki
1aa4f925d8 thermal: intel: intel_pch: Rename device operations callbacks
Because the same device operations callbacks are used for all supported
boards, they are in fact generic, so rename them to reflect that.

Also rename the operations object itself for consistency.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki
558718f4d3 thermal: intel: intel_pch: Eliminate redundant return pointers
Both pch_wpt_init() and pch_wpt_get_temp() can return the proper
result via their return values, so they do not need to use return
pointers.

Modify them accordingly.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki
2cee73568e thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
Modify pch_wpt_add_acpi_psv_trip() to return an int value instead of
using a return pointer for that.

While at it, drop an excessive empty code line.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki
1bcebcab88 thermal: intel: int340x: Improve int340x_thermal_set_trip_temp()
Instead of using snprintf() to populate the ACPI object name in
int340x_thermal_set_trip_temp(), use an appropriate initializer
and make the function fail if its trip argument is greater than 9,
because ACPI object names can only be 4 characters long and it does
not make sense to even try to evaluate objects with longer names (that
argument is guaranteed to be non-negative, because it comes from the
thermal code that will not pass negative trip numbers to zone
callbacks).

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki
d0009d14e9 thermal: intel: int340x: Drop pointless cast to unsigned long
The explicit casting from int to unsigned long in
int340x_thermal_get_zone_temp() is pointless, becuase the multiplication
result is cast back to int by the assignment in the same statement, so
drop it.

No expected functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki
67c6945867 thermal: intel: int340x: Rename variable in int340x_thermal_zone_add()
Rename local variables int34x_thermal_zone in int340x_thermal_zone_add()
and int340x_thermal_zone_remove() to int34x_zone which allows a number
of code lines to be shorter and easier to read and adjust some white
space for consistency.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki
be014c789c thermal: intel: int340x: Assorted minor cleanups
Improve some inconsistent usage of white space in int340x_thermal_zone.c,
fix up one coding style issue in it (missing braces around an else
branch of a conditional) and while at it replace a !ACPI_FAILURE()
check with an equivalent ACPI_SUCCESS() one.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki
dd3b3d160e thermal: ACPI: Make helpers retrieve temperature only
It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.

Modify the ACPI thermal helpers accordingly and update their users.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-02-02 15:26:45 +01:00
Rafael J. Wysocki
f364beb5b6 Merge branch 'thermal-intel'
Merge changes affecting thermal control on Intel platforms for 6.3-rc1:

 - Consolidate code accessing the Intel TCC (Thermal Control Circuitry)
   MSRs by introducing library functions for that and making the
   TCC-related code in thermal drivers use them (Zhang Rui).

 - Enhance the x86_pkg_temp_thermal driver to support dynamic tjmax
   changes (Zhang Rui).

 - Address an "unsigned expression compared with zero" warning in the
   intel_soc_dts_iosf thermal driver (Yang Li).

 - Update comments regarding two functions in the Intel Menlow thermal
   driver (Deming Wang).

 - Use sysfs_emit_at() instead of scnprintf() in the int340x thermal
   driver (ye xingchen).

 - Make the intel_pch thermal driver support the Wellsburg PCH (Tim
   Zimmermann).

 - Add trip point initialization helper functions for ACPI-defined trip
   points and modify two thermal drivers to use them (Rafael Wysocki,
   Daniel Lezcano).

 - Modify the intel_pch and processor_thermal_device_pci thermal drivers
   use generic trip point tables instead of thermal zone trip point
   callbacks (Daniel Lezcano).

 - Add production mode attribute sysfs attribute to the int340x thermal
   driver (Srinivas Pandruvada).

 - Rework dynamic trip point updates handling and locking in the int340x
   thermal driver (Rafael Wysocki).

 - Make the int340x thermal driver use a generic trip points table
   instead of thermal zone trip point callbacks (Rafael Wysocki, Daniel
   Lezcano).

* thermal-intel:
  thermal: intel: int340x: Use generic trip points table
  thermal: intel: int340x: Use zone lock for synchronization
  thermal: intel: int340x: Rework updating trip points
  thermal: ACPI: Initialize trips if temperature is out of range
  thermal: intel: processor_thermal_device_pci: Use generic trip point
  thermal: intel: int340x: Add production mode attribute
  thermal: intel: intel_pch: Use generic trip points
  thermal: ACPI: Add ACPI trip point routines
  thermal: intel: intel_pch: Add support for Wellsburg PCH
  thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()
  thermal: intel: menlow: Update function descriptions
  thermal: intel: Fix unsigned comparison with less than zero
  thermal/x86_pkg_temp_thermal: Add support for handling dynamic tjmax
  thermal/x86_pkg_temp_thermal: Use Intel TCC library
  thermal/intel/intel_tcc_cooling: Use Intel TCC library
  thermal/intel/intel_soc_dts_iosf: Use Intel TCC library
  thermal/int340x/processor_thermal: Use Intel TCC library
  thermal/intel: Introduce Intel TCC library
2023-01-30 14:13:26 +01:00
Rafael J. Wysocki
79b2027097 Merge back thermal control material for 6.3. 2023-01-27 15:55:23 +01:00
Rafael J. Wysocki
f4118dbe61 thermal: intel: int340x: Use generic trip points table
Modify int340x_thermal_zone_add() to register the thermal zone along
with a trip points table, which allows the trip-related zone callbacks
to be dropped, because they are not needed any more.

In order to consolidate the code, use ACPI trip library functions to
populate generic trip points in int340x_thermal_read_trips() and to
update them in int340x_thermal_update_trips().

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:11:12 +01:00
Rafael J. Wysocki
9e9b7e182c thermal: intel: int340x: Use zone lock for synchronization
Because the ->get_trip_temp() and ->get_trip_type() thermal zone
callbacks are only invoked from __thermal_zone_get_trip() which is
always called by the thermal core under the zone lock, it is sufficient
for int340x_thermal_update_trips() to acquire the zone lock for mutual
exclusion with those callbacks.

Accordingly, modify int340x_thermal_update_trips() to use the zone lock
instead of the internal trip_mutex and drop the latter which is not
necessary any more.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:11:12 +01:00
Rafael J. Wysocki
b1bf9dbffc thermal: intel: int340x: Rework updating trip points
It is generally invalid to change the trip point indices after they have
been exposed via sysfs.

Moreover, the thermal objects in the ACPI namespace cannot go away and
appear on the fly.  In practice, the only thing that can happen when the
INT3403_PERF_TRIP_POINT_CHANGED notification is sent by the platform
firmware is a change of the return values of those thermal objects.

For this reason, add a special function for updating the trip point
temperatures after re-evaluating the respective ACPI thermal objects
and change int3403_notify() to invoke it instead of
int340x_thermal_read_trips() that would change the trip point indices
on errors.  Also remove the locking from the latter, because it is only
called before registering the thermal zone and it cannot race with the
zone's callbacks.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:11:12 +01:00
Rafael J. Wysocki
97efecfdbf thermal: ACPI: Initialize trips if temperature is out of range
In some cases it is still useful to register a trip point if the
temperature returned by the corresponding ACPI thermal object (for
example, _HOT) is invalid to start with, because the same ACPI
thermal object may start to return a valid temperature after a
system configuration change (for example, from an AC power source
to battery an vice versa).

For this reason, if the ACPI thermal object evaluated by
thermal_acpi_trip_init() successfully returns a temperature value that
is out of the range of values taken into account, initialize the trip
point using THERMAL_TEMP_INVALID as the temperature value instead of
returning an error to allow the user of the trip point to decide what
to do with it.

Also update pch_wpt_add_acpi_psv_trip() to reject trip points with
invalid temperature values.

Fixes: 7a0e397488 ("thermal: ACPI: Add ACPI trip point routines")
Reported-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:09:47 +01:00
Rafael J. Wysocki
a5c926acd0 Merge back Intel thermal control changes for 6.3. 2023-01-27 15:08:08 +01:00
Rafael J. Wysocki
02be605946 - Fix kerneldoc format errors for Rockchip, Mediatek and Uniphier
(Randy Dunlap)
 
 - Add the missing 'qcom,adc-tm7' compatible string in the dt-bindings
   (Krzysztof Kozlowski)
 
 - Improve the calibration routine by relying on the nvmem to read the
   values and provide a set of fixes for the QCom tsens driver (Dmitry
   Baryshkov)
 
 - Remove the duplicate interrupt setting routine in the QCom tsens
   driver (Daniel Lezcano)
 
 - Fix a wrong loop condition in the i.MX SC thermal driver and add the
   iMX8QM sensors (Viorel Suman)
 
 - Fix header inclusion asm-generic.h by asm.h for the
   qcom-spmi-adc-tm5 driver (Andy Shevchenko)
 
 - Use the devm_platform_get_and_ioremap_resource() combo function in
   all the drivers where the conversion applies (Ye Xingchen)
 
 - Replace a literal mask by an existing corresponding macro (Yangtao
   Li)
 
 - Add support for MT7986 and MT7981 (Daniel Golle)
 
 - Use thermal_zone_get_crit_temp() for the Armada thermal driver
   (Daniel Lezcano)
 -----BEGIN PGP SIGNATURE-----
 
 iQEzBAABCAAdFiEEGn3N4YVz0WNVyHskqDIjiipP6E8FAmPSo/wACgkQqDIjiipP
 6E8jPAf/dSGd92V/BEbPDNL3OvhW7duX1g05HLwnjSLo4r2W/I+YFsmLkaJ81iPj
 E/gC29jHw6TAQN9DrEMRnjmHGH8SBPrphfZMM7Sbh3pgzTPGW5tXQln8ysbh+JUr
 0Aj4O6sA5mvcjd7r7u5JITGUHzZCm3L4Gv9bzr6O8M425u3di1PlI8XMsdaKBy5q
 N4zYR8yFCgbgM3ujjy/J4fYWRRTcYQ9kExa/OxvMDtZS4shBK34VN9IVt3z/W+Vs
 zNxKRynUZcVYddEZwYcBV+aTVAyFGLr5s5y6dzPo33h4M+Rl6reNE86el28fglu0
 diZK79mef3KtV8Dn6lw9r+Fd/6heHw==
 =ZJEq
 -----END PGP SIGNATURE-----

Merge tag 'thermal-v6.3-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux into thermal-next

Pull thermal control material for 6.3-rc1 from Daniel Lezcano:

"- Fix kerneldoc format errors for Rockchip, Mediatek and Uniphier
   (Randy Dunlap)

 - Add the missing 'qcom,adc-tm7' compatible string in the dt-bindings
   (Krzysztof Kozlowski)

 - Improve the calibration routine by relying on the nvmem to read the
   values and provide a set of fixes for the QCom tsens driver (Dmitry
   Baryshkov)

 - Remove the duplicate interrupt setting routine in the QCom tsens
   driver (Daniel Lezcano)

 - Fix a wrong loop condition in the i.MX SC thermal driver and add the
   iMX8QM sensors (Viorel Suman)

 - Fix header inclusion asm-generic.h by asm.h for the
   qcom-spmi-adc-tm5 driver (Andy Shevchenko)

 - Use the devm_platform_get_and_ioremap_resource() combo function in
   all the drivers where the conversion applies (Ye Xingchen)

 - Replace a literal mask by an existing corresponding macro (Yangtao
   Li)

 - Add support for MT7986 and MT7981 (Daniel Golle)

 - Use thermal_zone_get_crit_temp() for the Armada thermal driver
   (Daniel Lezcano)"

* tag 'thermal-v6.3-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (35 commits)
  thermal/drivers/armada: Use the thermal_zone_get_crit_temp()
  thermal/drivers/mtk: Add support for MT7986 and MT7981
  thermal/drivers/mtk: Use function pointer for raw_to_mcelsius
  thermal/drivers/sun8i: Convert to use macro
  thermal/drivers/spear: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/kirkwood: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/thermal_mmio: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/rockchip: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/mtk_thermal: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/armada: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/dove: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/bcm2835: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/brcmstb_thermal: Use devm_platform_get_and_ioremap_resource()
  thermal/drivers/qcom-spmi-adc-tm5: Use asm intead of asm-generic
  thermal/drivers/imx_sc_thermal: Add iMX8QM sensors
  thermal/drivers/imx_sc_thermal: Fix the loop condition
  thermal/drivers/qcom: Remove duplicate set next trip point interrupt code
  thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956
  thermal/drivers/tsens: Drop single-cell code for msm8939
  thermal/drivers/tsens: Drop single-cell code for mdm9607
  ...
2023-01-26 17:21:24 +01:00
Daniel Lezcano
e90eb1df70 thermal: intel: processor_thermal_device_pci: Use generic trip point
Make proc_thermal_pci_probe() register the TCPU_PCI thermal zone along
with the trip point used by it and drop the zone callbacks related to
this trip point that are not needed any more.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-26 16:17:28 +01:00
Srinivas Pandruvada
5c36cf2784 thermal: intel: int340x: Add production mode attribute
It is possible that the system manufacturer locks down thermal tuning
beyond what is usually done on the given platform. In that case user
space calibration tools should not try to adjust the thermal
configuration of the system.

To allow user space to check if that is the case, add a new sysfs
attribute "production_mode" that will be present when the ACPI DCFG
method is present under the INT3400 device object in the ACPI Namespace.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-26 14:47:16 +01:00
Rafael J. Wysocki
9e0a9be24b thermal: Fail object registration if thermal class is not registered
If thermal_class is not registered with the driver core, there is no way
to expose the interfaces used by the thermal control framework, so
prevent thermal zones and cooling devices from being registered in
that case by returning an error from object registration functions.

For this purpose, use a thermal_class pointer that will be NULL if the
class is not registered.  To avoid wasting memory in that case, allocate
the thermal class object dynamically and if it fails to register, free
it and clear the thermal_class pointer to NULL.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2023-01-25 16:51:19 +01:00
Daniel Lezcano
5b8de18ee9 thermal/core: Move the thermal trip code to a dedicated file
The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...

This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.

For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.

The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 16:40:39 +01:00
Daniel Lezcano
b57d62862d thermal/core: Remove unneeded ida_destroy()
As per documentation for the ida_destroy() function: "If the IDA is
already empty, there is no need to call this function."

The thermal framework is in the init sequence, so the ida was not yet
used and consequently it is empty in case of error.

There is no need to call ida_destroy(), let's remove the calls.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 16:40:39 +01:00
Daniel Lezcano
58d1c9fd0e thermal/core: Fix unregistering netlink at thermal init time
The thermal subsystem initialization miss an netlink unregistering
function in the error. Add it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 16:40:39 +01:00
Rafael J. Wysocki
acd7e9ee57 thermal: intel: int340x: Add locking to int340x_thermal_get_trip_type()
In order to prevent int340x_thermal_get_trip_type() from possibly
racing with int340x_thermal_read_trips() invoked by int3403_notify()
add locking to it in analogy with int340x_thermal_get_trip_temp().

Fixes: 6757a7abe4 ("thermal: intel: int340x: Protect trip temperature from concurrent updates")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 15:37:21 +01:00
Srinivas Pandruvada
6757a7abe4 thermal: intel: int340x: Protect trip temperature from concurrent updates
Trip temperatures are read using ACPI methods and stored in the memory
during zone initializtion and when the firmware sends a notification for
change. This trip temperature is returned when the thermal core calls via
callback get_trip_temp().

But it is possible that while updating the memory copy of the trips when
the firmware sends a notification for change, thermal core is reading the
trip temperature via the callback get_trip_temp(). This may return invalid
trip temperature.

To address this add a mutex to protect the invalid temperature reads in
the callback get_trip_temp() and int340x_thermal_read_trips().

Fixes: 5fbf7f27fa ("Thermal/int340x: Add common thermal zone handler")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 5.0+ <stable@vger.kernel.org> # 5.0+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-24 21:28:19 +01:00