SPI platform device definitions consolidated from respective machine
folder to plat-samsung
Signed-off-by: Padmavathi Venna <padma.v@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Move the platform device definitions from boards code to plat-samsung
to avoid multiple instances when multiple board support is compiled in.
The boards should select at least S5P_DEV_FIMC0 to enable FIMC support.
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch merges each dev files to one devs.c file in
plat-samsung directory and this help to keep it more
easily to reduce plat- directories such as plat-s3c24xx
and plat-s5p.
Cc: Ben Dooks <ben-linux@fluff.org>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch adds all the resources for TV drivers and devices for Samsung
Exynos4 and S5PV210 platforms.
Signed-off-by: Tomasz Stanislawski <t.stanislaws@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
[m.szyprowski: squashed Exynos4 and S5PV210 patches and rewrote commit message]
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch adds hdmiphy dedicated i2c controller definitions.
Signed-off-by: Tomasz Stanislawski <t.stanislaws@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
[m.szyprowski: renamed to i2c-hdmiphy and squashed Exynos4 and S5PV210 patches]
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Add support for MFC device to plat-s5p, mach-exynos4, mach-s5pv210:
- clock support
- memory mapping and reserving
- s5p_device_mfc platform device
Signed-off-by: Kamil Debski <k.debski@samsung.com>
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch adds platform device s5p_device_fimd0 for EXYNOS4 FIMD0.
EXYNOS4 has two FIMDs(FIMD0, FIMD1). FIMD1 will be added later.
Some definitions used to enable EXYNOS4 FIMD0 are added.
Signed-off-by: Jonghun Han <jonghun.han@samsung.com>
Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Exynos4 and S5PC110(S5PV210) has Internal dma(idma) in AUDSS.
To support idma, register idma platform device.
and Exynos4 and S5PC110 has different IDMA address.
TO handle different IDMA address, register idma platform data
Signed-off-by: Sangbeom Kim <sbkim73@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
There has been no #ifndef - #define - #endif protection for this
header file.
Signed-off-by: MyungJoo Ham <myungjoo.ham@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Changed the SPI platform device name from S5P6450 to S5P64x0 as it is
defined common for both S5p6440 and S5P6450 in dev-spi.c of S5P64x0.
Signed-off-by: Padmavathi Venna <padma.v@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
S3C2416, S3C2443 and S3C2450 includes a USB High-Speed Gadget controller module.
This patch adds the following for supporting this controller.
1. Definition for USB High-Speed controller base address.
2. Platform device instantiation.
3. Declaration for platform data structure.
4. Functionality to setup platform data for the controller.
Signed-off-by: Thomas Abraham <thomas.ab@samsung.com>
Signed-off-by: Sangbeom Kim <sbkim73@samsung.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Adds the device definitions, platform specific initialization
and clocks for SATA on ARMLEX4210.
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Add support for fourth FIMC platform device definition and define
resources for FIMC modules on EXYNOS4 machines.
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch updates device support of EXYNOS4 according to the change of
ARCH name, EXYNOS4.
Cc: Ben Dooks <ben-linux@fluff.org>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch adds support System MMU for S5PV310 and S5PC210.
Signed-off-by: Donguk Ryu <du.ryu@samsung.com>
Signed-off-by: Sangbeom Kim <sbkim73@samsung.com>
[kgene.kim@samsung.com: changed SYSMMU config name]
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
There may be up to two MIPI CSI slave interfaces depending on the SoC version.
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch adds support Power Domain for S5PV310 and S5PC210.
Signed-off-by: Changhwan Youn <chaos.youn at samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Segregate I2S devices for S5P6440 and S5P6450.
Signed-off-by: Rajeshwari Shinde <rajeshwari.s@samsung.com>
Signed-off-by: Jassi Brar <jassi.brar@samsung.com>
Acked-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
The ASoC uses common DMA driver for Audio devices. So it makes
sense to a common audio-dma device shared across all platforms.
Signed-off-by: Jassi Brar <jassi.brar@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Liam Girdwood <lrg@slimlogic.co.uk>
Signed-off-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
Define platform devices for all audio devices found on S5PV310
Signed-off-by: Jassi Brar <jassi.brar@samsung.com>
Acked-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
Acked-by: Liam Girdwood <lrg@slimlogic.co.uk>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
* 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/tiwai/sound-2.6: (365 commits)
ALSA: hda - Disable sticky PCM stream assignment for AD codecs
ALSA: usb - Creative USB X-Fi volume knob support
ALSA: ca0106: Use card specific dac id for mute controls.
ALSA: ca0106: Allow different sound cards to use different SPI channel mappings.
ALSA: ca0106: Create a nice spot for mapping channels to dacs.
ALSA: ca0106: Move enabling of front dac out of hardcoded setup sequence.
ALSA: ca0106: Pull out dac powering routine into separate function.
ALSA: ca0106 - add Sound Blaster 5.1vx info.
ASoC: tlv320dac33: Use usleep_range for delays
ALSA: usb-audio: add Novation Launchpad support
ALSA: hda - Add workarounds for CT-IBG controllers
ALSA: hda - Fix wrong TLV mute bit for STAC/IDT codecs
ASoC: tpa6130a2: Error handling for broken chip
ASoC: max98088: Staticise m98088_eq_band
ASoC: soc-core: Fix codec->name memory leak
ALSA: hda - Apply ideapad quirk to Acer laptops with Cxt5066
ALSA: hda - Add some workarounds for Creative IBG
ALSA: hda - Fix wrong SPDIF NID assignment for CA0110
ALSA: hda - Fix codec rename rules for ALC662-compatible codecs
ALSA: hda - Add alc_init_jacks() call to other codecs
...
This patch add S/PDIF platform device to support S/PDIF PCM audio
on S5PV210.
Signed-off-by: Seungwhan Youn <sw.youn@samsung.com>
Acked-by: Jassi Brar <jassi.brar@samsung.com>
Acked-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch add S/PDIF platform device to support S/PDIF PCM audio
on S5PC100.
Signed-off-by: Seungwhan Youn <sw.youn@samsung.com>
Acked-by: Jassi Brar <jassi.brar@samsung.com>
Acked-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
S5PV310 and S5PC210 support more I2C devices than previous SoCs.
Add the device support code for them.
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch updates Audio and SPI for S5P6440 and S5P6450 SoCs.
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Cc: Jassi Brar <jassi.brar@samsung.com>
This patch moves OneNAND device definitions from mach-s5pv210 to plat-s5p
so that can support it commonly.
Note: S5PC110 and S5PC210 have same OneNAND driver.
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Cc: Kyungmin Park <kyungmin.park@samsung.com>
Fairly simple conflicts, the most serious ones are the i.MX ones which I
suspect now need another rename.
Conflicts:
arch/arm/mach-mx2/clock_imx27.c
arch/arm/mach-mx2/devices.c
arch/arm/mach-omap2/board-rx51-peripherals.c
arch/arm/mach-omap2/board-zoom2.c
sound/soc/fsl/mpc5200_dma.c
sound/soc/fsl/mpc5200_dma.h
sound/soc/fsl/mpc8610_hpcd.c
sound/soc/pxa/spitz.c
This patch extends the ASoC API to allow sound cards to have more than one
CODEC and more than one platform DMA controller. This is achieved by dividing
some current ASoC structures that contain both driver data and device data into
structures that only either contain device data or driver data. i.e.
struct snd_soc_codec ---> struct snd_soc_codec (device data)
+-> struct snd_soc_codec_driver (driver data)
struct snd_soc_platform ---> struct snd_soc_platform (device data)
+-> struct snd_soc_platform_driver (driver data)
struct snd_soc_dai ---> struct snd_soc_dai (device data)
+-> struct snd_soc_dai_driver (driver data)
struct snd_soc_device ---> deleted
This now allows ASoC to be more tightly aligned with the Linux driver model and
also means that every ASoC codec, platform and (platform) DAI is a kernel
device. ASoC component private data is now stored as device private data.
The ASoC sound card struct snd_soc_card has also been updated to store lists
of it's components rather than a pointer to a codec and platform. The PCM
runtime struct soc_pcm_runtime now has pointers to all its components.
This patch adds DAPM support for ASoC multi-component and removes struct
snd_soc_socdev from DAPM core. All DAPM calls are now made on a card, codec
or runtime PCM level basis rather than using snd_soc_socdev.
Other notable multi-component changes:-
* Stream operations now de-reference less structures.
* close_delayed work() now runs on a DAI basis rather than looping all DAIs
in a card.
* PM suspend()/resume() operations can now handle N CODECs and Platforms
per sound card.
* Added soc_bind_dai_link() to bind the component devices to the sound card.
* Added soc_dai_link_probe() and soc_dai_link_remove() to probe and remove
DAI link components.
* sysfs entries can now be registered per component per card.
* snd_soc_new_pcms() functionailty rolled into dai_link_probe().
* snd_soc_register_codec() now does all the codec list and mutex init.
This patch changes the probe() and remove() of the CODEC drivers as follows:-
o Make CODEC driver a platform driver
o Moved all struct snd_soc_codec list, mutex, etc initialiasation to core.
o Removed all static codec pointers (drivers now support > 1 codec dev)
o snd_soc_register_pcms() now done by core.
o snd_soc_register_dai() folded into snd_soc_register_codec().
CS4270 portions:
Acked-by: Timur Tabi <timur@freescale.com>
Some TLV320aic23 and Cirrus platform fixes.
Signed-off-by: Ryan Mallon <ryan@bluewatersys.com>
TI CODEC and OMAP fixes
Signed-off-by: Peter Ujfalusi <peter.ujfalusi@nokia.com>
Signed-off-by: Janusz Krzysztofik <jkrzyszt@tis.icnet.pl>
Signed-off-by: Jarkko Nikula <jhnikula@gmail.com>
Samsung platform and misc fixes :-
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Joonyoung Shim <jy0922.shim@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Jassi Brar <jassi.brar@samsung.com>
Signed-off-by: Seungwhan Youn <sw.youn@samsung.com>
MPC8610 and PPC fixes.
Signed-off-by: Timur Tabi <timur@freescale.com>
i.MX fixes and some core fixes.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
J4740 platform fixes:-
Signed-off-by: Lars-Peter Clausen <lars@metafoo.de>
CC: Tony Lindgren <tony@atomide.com>
CC: Nicolas Ferre <nicolas.ferre@atmel.com>
CC: Kevin Hilman <khilman@deeprootsystems.com>
CC: Sascha Hauer <s.hauer@pengutronix.de>
CC: Atsushi Nemoto <anemo@mba.ocn.ne.jp>
CC: Kuninori Morimoto <morimoto.kuninori@renesas.com>
CC: Daniel Gloeckner <dg@emlix.com>
CC: Manuel Lauss <mano@roarinelk.homelinux.net>
CC: Mike Frysinger <vapier.adi@gmail.com>
CC: Arnaud Patard <apatard@mandriva.com>
CC: Wan ZongShun <mcuos.com@gmail.com>
Acked-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
Signed-off-by: Liam Girdwood <lrg@slimlogic.co.uk>
FIMC (CAMIF) device is a camera interface embedded in S3C/S5P Samsung
SOC series. It supports ITU-R BT.601/656 and MIPI-CSI2 standards,
memory to memory operations, color conversion, resizing and rotation.
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This patch adds hsmmc3 device definition in plat-samsung. Because now
S5PV210 can support 4 hsmmc such as hsmmc0, hsmmc1, hsmmc2 and hsmmc3
and that can be used in further Samsung SoCs.
Signed-off-by: Hyuk Lee <hyuk1.lee@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Following has been added:
- Common CF Platform device definition
- Platform data strucure definition
- CF controller register definitions
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
This is intended to replace a number of sites in the Samsung kernel
where the same thing is being repeated in specific platform setting
code. See next patches for replacements.
Signed-off-by: Ben Dooks <ben-linux@fluff.org>
[kgene.kim@samsung.com: This is for building test]
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
