The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.
Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang).
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control
driver (Rafael Wysocki).
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Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These start a rework of the handling of trip points in the thermal
core, improve the cpufreq/devfreq cooling device handling, update some
thermal control drivers and the tmon utility and clean up code.
Specifics:
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to
be used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3
(Wolfram Sang).
- Convert the QCom tsens DT binding to the dtsformat format
(Krzysztof Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
control driver (Rafael Wysocki)"
* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
Remove unneeded global variable devfreq_cooling_ops which is used only
as a copy pattern. Instead, extend the struct devfreq_cooling_device with
the needed ops structure. This also simplifies the allocation/free code
during the setup/cleanup.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20220613124327.30766-5-lukasz.luba@arm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The milli-Watts precision causes rounding errors while calculating
efficiency cost for each OPP. This is especially visible in the 'simple'
Energy Model (EM), where the power for each OPP is provided from OPP
framework. This can cause some OPPs to be marked inefficient, while
using micro-Watts precision that might not happen.
Update all EM users which access 'power' field and assume the value is
in milli-Watts.
Solve also an issue with potential overflow in calculation of energy
estimation on 32bit machine. It's needed now since the power value
(thus the 'cost' as well) are higher.
Example calculation which shows the rounding error and impact:
power = 'dyn-power-coeff' * volt_mV * volt_mV * freq_MHz
power_a_uW = (100 * 600mW * 600mW * 500MHz) / 10^6 = 18000
power_a_mW = (100 * 600mW * 600mW * 500MHz) / 10^9 = 18
power_b_uW = (100 * 605mW * 605mW * 600MHz) / 10^6 = 21961
power_b_mW = (100 * 605mW * 605mW * 600MHz) / 10^9 = 21
max_freq = 2000MHz
cost_a_mW = 18 * 2000MHz/500MHz = 72
cost_a_uW = 18000 * 2000MHz/500MHz = 72000
cost_b_mW = 21 * 2000MHz/600MHz = 70 // <- artificially better
cost_b_uW = 21961 * 2000MHz/600MHz = 73203
The 'cost_b_mW' (which is based on old milli-Watts) is misleadingly
better that the 'cost_b_uW' (this patch uses micro-Watts) and such
would have impact on the 'inefficient OPPs' information in the Cpufreq
framework. This patch set removes the rounding issue.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Add thermal library and thermal tools to encapsulate the netlink
into event based callbacks (Daniel Lezcano, Jiapeng Chong).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary).
- Add new k3 j72xx bangdap driver and the corresponding bindings
(Keerthy).
- Fix missing of_node_put() in the SC iMX driver at probe time
(Miaoqian Lin).
- Fix memory leak in __thermal_cooling_device_register() when
device_register() fails by calling thermal_cooling_device_destroy_sysfs()
(Yang Yingliang).
- Add sc8180x and sc8280xp compatible string in the DT bindings and
lMH support for QCom tsens driver (Bjorn Andersson).
- Fix OTP Calibration Register values conforming to the documentation
on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das).
- Fix type in kerneldoc description for __thermal_bind_params (Corentin
Labbe).
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom
platform (Zheng Yongjun).
- Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi).
- Fix non-negative value support by preventing the value to be clamp
to zero (Stefan Wahren).
- Add compatible string and DT bindings for MSM8960 tsens driver
(Dmitry Baryshkov).
- Add hwmon support for K3 driver (Massimiliano Minella).
- Refactor and add multiple generations support for QCom ADC driver
(Jishnu Prakash).
- Use platform_get_irq_optional() to get the interrupt on RCar driver and
document Document RZ/V2L bindings (Lad Prabhakar).
- Remove NULL check after container_of() call from the Intel HFI
thermal driver (Haowen Bai).
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Merge tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These add a thermal library and thermal tools to wrap the netlink
interface into event-based callbacks, improve overheat condition
handling during suspend-to-idle on Intel SoCs, add some new hardware
support, fix bugs and clean up code.
Specifics:
- Add thermal library and thermal tools to encapsulate the netlink
into event based callbacks (Daniel Lezcano, Jiapeng Chong).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary).
- Add new k3 j72xx bangdap driver and the corresponding bindings
(Keerthy).
- Fix missing of_node_put() in the SC iMX driver at probe time
(Miaoqian Lin).
- Fix memory leak in __thermal_cooling_device_register()
when device_register() fails by calling
thermal_cooling_device_destroy_sysfs() (Yang Yingliang).
- Add sc8180x and sc8280xp compatible string in the DT bindings and
lMH support for QCom tsens driver (Bjorn Andersson).
- Fix OTP Calibration Register values conforming to the documentation
on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das).
- Fix type in kerneldoc description for __thermal_bind_params
(Corentin Labbe).
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom
platform (Zheng Yongjun).
- Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi).
- Fix non-negative value support by preventing the value to be clamp
to zero (Stefan Wahren).
- Add compatible string and DT bindings for MSM8960 tsens driver
(Dmitry Baryshkov).
- Add hwmon support for K3 driver (Massimiliano Minella).
- Refactor and add multiple generations support for QCom ADC driver
(Jishnu Prakash).
- Use platform_get_irq_optional() to get the interrupt on RCar driver
and document Document RZ/V2L bindings (Lad Prabhakar).
- Remove NULL check after container_of() call from the Intel HFI
thermal driver (Haowen Bai)"
* tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits)
thermal: intel: pch: improve the cooling delay log
thermal: intel: pch: enhance overheat handling
thermal: intel: pch: move cooling delay to suspend_noirq phase
PM: wakeup: expose pm_wakeup_pending to modules
thermal: k3_j72xx_bandgap: Add the bandgap driver support
dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
thermal/core: Fix memory leak in __thermal_cooling_device_register()
dt-bindings: thermal: tsens: Add sc8280xp compatible
dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
thermal/drivers/qcom/lmh: Add sc8180x compatible
thermal/drivers/rz2gl: Fix OTP Calibration Register values
dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
thermal: thermal_of: fix typo on __thermal_bind_params
tools/thermal: remove unneeded semicolon
tools/lib/thermal: remove unneeded semicolon
thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
tools/thermal: Add thermal daemon skeleton
tools/thermal: Add a temperature capture tool
tools/thermal: Add util library
...
Fix access illegal address problem in following condition:
There are multiple devfreq cooling devices in system, some of them has
EM model but others do not. Energy model ops such as state2power will
append to global devfreq_cooling_ops when the cooling device with
EM model is registered. It makes the cooling device without EM model
also use devfreq_cooling_ops after appending when registered later by
of_devfreq_cooling_register_power() or of_devfreq_cooling_register().
The IPA governor regards the cooling devices without EM model as a power
actor, because they also have energy model ops, and will access illegal
address at dfc->em_pd when execute cdev->ops->get_requested_power,
cdev->ops->state2power or cdev->ops->power2state.
Fixes: 615510fe13 ("thermal: devfreq_cooling: remove old power model and use EM")
Cc: 5.13+ <stable@vger.kernel.org> # 5.13+
Signed-off-by: Kant Fan <kant@allwinnertech.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The Energy Model can now be artificial, which means the power values
are mathematically generated to leverage EAS while not expected to be on
an uniform scale with other devices providing power information. If this
EM type is in use, the thermal governor IPA should not be allowed to
operate, since the relation between cooling devices is not properly
defined. Thus, it might be possible that big GPU has lower power values
than a Little CPU. To mitigate a misbehaviour of the thermal control
algorithm, simply do not register the cooling device as IPA's power
actor.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Ionela Voinescu <ionela.voinescu@arm.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
HZ unit conversion macros are available in units.h, use them and remove
the duplicate definition.
The new macro uses a unsigned long type which is already the type in the
current code via the 'freq' variable.
Link: https://lkml.kernel.org/r/20210816114732.1834145-4-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Reviewed-by: Christian Eggers <ceggers@arri.de>
Cc: Chanwoo Choi <cw00.choi@samsung.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jonathan Cameron <jic23@kernel.org>
Cc: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Kyungmin Park <kyungmin.park@samsung.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Lukasz Luba <lukasz.luba@arm.com>
Cc: Maxime Coquelin <mcoquelin.stm32@gmail.com>
Cc: Miquel Raynal <miquel.raynal@bootlin.com>
Cc: MyungJoo Ham <myungjoo.ham@samsung.com>
Cc: Peter Meerwald <pmeerw@pmeerw.net>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
Fix function name in devfreq_cooling.c comment to remove a
warning found by kernel-doc.
drivers/thermal/devfreq_cooling.c:479: warning: expecting prototype for
devfreq_cooling_em_register_power(). Prototype was for
devfreq_cooling_em_register() instead.
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Reviewed-by: Nick Desaulniers <ndesaulniers@google.com>
Reviewed-by: Nathan Chancellor <nathan@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1623223350-128104-1-git-send-email-yang.lee@linux.alibaba.com
The following error is reported by kbuild:
smatch warnings:
drivers/thermal/devfreq_cooling.c:433 of_devfreq_cooling_register_power() warn: passing zero to 'ERR_PTR'
Fix the error code by the setting the 'err' variable instead of 'cdev'.
Fixes: f8d354e821 ("thermal/drivers/devfreq_cooling: Use device name instead of auto-numbering")
Reported-by: kernel test robot <lkp@intel.com>
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210319202424.890968-1-daniel.lezcano@linaro.org
Currently the naming of a cooling device is just a cooling technique
followed by a number. When there are multiple cooling devices using
the same technique, it is impossible to clearly identify the related
device as this one is just a number.
For instance:
thermal-devfreq-0
thermal-devfreq-1
etc ...
The 'thermal' prefix is redundant with the subsystem namespace. This
patch removes the 'thermal' prefix and changes the number by the device
name. So the naming above becomes:
devfreq-5000000.gpu
devfreq-1d84000.ufshc
etc ...
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210314111333.16551-3-daniel.lezcano@linaro.org
Prevent build failure if the option CONFIG_ENERGY_MODEL is not set. The
devfreq cooling is able to operate without the Energy Model.
Don't use dev->em_pd directly and use local pointer.
Fixes: 615510fe13 ("thermal: devfreq_cooling: remove old power model and use EM")
Reported-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201215154221.8828-1-lukasz.luba@arm.com
Remove old power model and use new Energy Model to calculate the power
budget. It drops static + dynamic power calculations and power table
in order to use Energy Model performance domain data. This model
should be easy to use and could find more users. It is also less
complicated to setup the needed structures.
Reviewed-by: Ionela Voinescu <ionela.voinescu@arm.com>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201210143014.24685-5-lukasz.luba@arm.com
The Energy Model (EM) framework supports devices such as Devfreq. Create
new registration function which automatically register EM for the thermal
devfreq_cooling devices. This patch prepares the code for coming changes
which are going to replace old power model with the new EM.
Reviewed-by: Ionela Voinescu <ionela.voinescu@arm.com>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201210143014.24685-4-lukasz.luba@arm.com
Devfreq cooling needs to now the correct status of the device in order
to operate. Devfreq framework can change the device status in the
background. To mitigate issues make a copy of the status structure and use
it for internal calculations.
In addition this patch adds normalization function, which also makes sure
that whatever data comes from the device, the load will be in range from 1
to 1024.
Reviewed-by: Ionela Voinescu <ionela.voinescu@arm.com>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201210143014.24685-3-lukasz.luba@arm.com
Prepare for deleting the static and dynamic power calculation and clean
the trace function. These two fields are going to be removed in the next
changes.
Reviewed-by: Ionela Voinescu <ionela.voinescu@arm.com>
Reviewed-by: Steven Rostedt (VMware) <rostedt@goodmis.org> # for tracing code
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201210143014.24685-2-lukasz.luba@arm.com
1. devfreq_cooling.c: The variable *tz is not used in
devfreq_cooling_get_requested_power(), devfreq_cooling_state2power()
and devfreq_cooling_power2state().
2. cpufreq_cooling.c: After 84fe2cab48, the variable *tz is not used
anymore in cpufreq_get_requested_power(), cpufreq_state2power() and
cpufreq_power2state().
Remove the variable *tz.
Signed-off-by: zhuguangqing <zhuguangqing@xiaomi.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200914071101.13575-1-zhuguangqing83@gmail.com
Now that devfreq supports limiting the frequency range of a device
through PM QoS make use of it instead of disabling OPPs that should
not be used.
The switch from disabling OPPs to PM QoS introduces a subtle behavioral
change in case of conflicting requests (min > max): PM QoS gives
precedence to the MIN_FREQUENCY request, while higher OPPs disabled
with dev_pm_opp_disable() would override MIN_FREQUENCY.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200318114548.19916-4-lukasz.luba@arm.com
Fix up the following warnings with make W=1:
linux.git/drivers/thermal/devfreq_cooling.c:68: warning: Function
parameter or member 'capped_state' not described in
'devfreq_cooling_device'
linux.git/drivers/thermal/devfreq_cooling.c:593: warning: Function
parameter or member 'cdev' not described in 'devfreq_cooling_unregister'
linux.git/drivers/thermal/devfreq_cooling.c:593: warning: Excess
function parameter 'dfc' description in 'devfreq_cooling_unregister'
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/7059d82472fe12139fc7a3379c5b9716a23cce5c.1574242756.git.amit.kucheria@linaro.org
This patch adds another parameter to the trace function:
trace_thermal_power_devfreq_get_power().
In case when we call directly driver's code for the real power,
we do not have static/dynamic_power values. Instead we get total
power in the '*power' value. The 'static_power' and
'dynamic_power' are set to 0.
Therefore, we have to trace that '*power' value in this scenario.
CC: Steven Rostedt <rostedt@goodmis.org>
CC: Ingo Molnar <mingo@redhat.com>
CC: Zhang Rui <rui.zhang@intel.com>
CC: Eduardo Valentin <edubezval@gmail.com>
Acked-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
This patch introduces a new interface for device drivers connected to
devfreq_cooling in the thermal framework: get_real_power().
Some devices have more sophisticated methods (like power counters)
to approximate the actual power that they use.
In the previous implementation we had a pre-calculated power
table which was then scaled by 'utilization'
('busy_time' and 'total_time' taken from devfreq 'last_status').
With this new interface the driver can provide more precise data
regarding actual power to the thermal governor every time the power
budget is calculated. We then use this value and calculate the real
resource utilization scaling factor.
Reviewed-by: Chris Diamand <chris.diamand@arm.com>
Acked-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Move the code which gets the voltage for a given frequency.
This code will be resused in few places.
Acked-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
It is possible for dev_pm_opp_find_freq_exact() to return errors. It was
all fine earlier as dev_pm_opp_get_voltage() had a check within it to
check for invalid OPPs, but dev_pm_opp_put() doesn't have any similar
checks and the callers need to make sure OPP is valid before calling
them.
Also update the later dev_warn_ratelimited() to not print the error
message as the OPP is guaranteed to be valid now.
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
There isn't much the user can do on seeing this warning, as the hardware
is actually okay. dev_err suits much better here.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
There is no need to check for IS_ERR() as we are looking for a very
particular error value here. Drop the first check.
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- add thermal driver for R-Car Gen3 thermal sensors.
- add thermal driver for ZTE' zx2967 family thermal sensors.
- convert thermal ID allocation from IDR to IDA.
- fix a possible NULL dereference in imx thermal driver.
- fix a ti-soc-thermal driver dependency issue so that critical thermal
control is still available when CPU_THERMAL is not defined.
- update binding information for QorIQ thermal driver.
- a couple of cleanups in thermal core, intel_powerclamp, exynos,
dra752-thermal, mtk-thermal driver.
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
powerpc/mpc85xx: Update TMU device tree node for T1023/T1024
powerpc/mpc85xx: Update TMU device tree node for T1040/T1042
dt-bindings: Update QorIQ TMU thermal bindings
thermal: mtk_thermal: Staticise a number of data variables
thermal: arm: dra752: Remove all TSHUT related definitions
thermal: arm: dra752: Remove TSHUT configuration
thermal: ti-soc-thermal: Remove CPU_THERMAL Dependency from TI_THERMAL
thermal: imx: Fix possible NULL dereference.
thermal: exynos: Remove parsing unused samsung,tmu_cal_mode property
thermal: zx2967: add thermal driver for ZTE's zx2967 family
thermal: use cpumask_var_t for on-stack cpu masks
dt: bindings: add documentation for zx2967 family thermal sensor
thermal/intel_powerclamp: Remove set-but-not-used variables
thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver
thermal: rcar_gen3_thermal: Document the R-Car Gen3
thermal: convert devfreq_cooling to use an IDA
thermal: convert cpu_cooling to use an IDA
thermal: convert clock cooling to use an IDA
thermal core: convert ID allocation to IDA
This patch updates dev_pm_opp_find_freq_*() routines to get a reference
to the OPPs returned by them.
Also updates the users of dev_pm_opp_find_freq_*() routines to call
dev_pm_opp_put() after they are done using the OPPs.
As it is guaranteed the that OPPs wouldn't get freed while being used,
the RCU read side locking present with the users isn't required anymore.
Drop it as well.
This patch also updates all users of devfreq_recommended_opp() which was
returning an OPP received from the OPP core.
Note that some of the OPP core routines have gained
rcu_read_{lock|unlock}() calls, as those still use RCU specific APIs
within them.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com> [Devfreq]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
thermal devfreq cooling does not use the ability to look up pointers by
ID, so convert it from using an IDR to the more space-efficient IDA.
Signed-off-by: Matthew Wilcox <mawilcox@microsoft.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
When the devfreq cooling device was designed, it was an oversight not to
pass a pointer to the struct devfreq as the first parameters of the
callbacks. The design patterns of the kernel suggest it for a good
reason.
By passing a pointer to struct devfreq, the driver can register one
function that works with multiple devices. With the current
implementation, a driver that can work with multiple devices has to
create multiple copies of the same function with different parameters so
that each devfreq_cooling_device can use the appropriate one. By
passing a pointer to struct devfreq, the driver can identify which
device it's referring to.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Punit Agrawal <punit.agrawal@arm.com>
Reviewed-by: Ørjan Eide <orjan.eide@arm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
We could see that state is defined as unsigned type, so it
should never be less than zero. Let' remove this check.
Signed-off-by: Shawn Lin <shawn.lin@rock-chips.com>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
If the allocation fails then we can't continue.
Fixes: a76caf55e5 ('thermal: Add devfreq cooling')
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The prototype of do_div() is:
uint32_t do_div(uint64_t *n, uint32_t base);
Make power u64 to avoid the following warning:
drivers/thermal/devfreq_cooling.c: In function 'get_dynamic_power':
drivers/thermal/devfreq_cooling.c:267:2: warning: comparison of distinct pointer types lacks a cast [enabled by default]
drivers/thermal/devfreq_cooling.c:267:2: warning: right shift count >= width of type [enabled by default]
drivers/thermal/devfreq_cooling.c:267:2: warning: passing argument 1 of '__div64_32' from incompatible pointer type [enabled by default]
include/asm-generic/div64.h:35:17: note: expected 'uint64_t *' but argument is of type 'long unsigned int *'
Reported-by: kbuild test robot <fengguang.wu@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Be consistent with what other cooling devices do and return a struct
thermal_cooling_device * on register. Also, for the unregister, accept
a struct thermal_cooling_device * as parameter.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Tracing is useful for debugging and performance tuning. Add similar
traces to what's present in the cpu cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Steven Rostedt <rostedt@goodmis.org>
Cc: Ingo Molnar <mingo@redhat.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.
The device must use devfreq. In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
