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usb: musb: Fix randconfig build issues for Kconfig options

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Commit 82c02f58ba ("usb: musb: Allow multiple glue layers to be
built in") enabled selecting multiple glue layers, which in turn
exposed things more for randconfig builds. If NOP_USB_XCEIV is
built-in and TUSB6010 is a loadable module, we will get:

drivers/built-in.o: In function `tusb_remove':
tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
drivers/built-in.o: In function `tusb_probe':
tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
make: *** [vmlinux] Error 1

Let's fix this the same way as commit 70c1ff4b3c ("usb: musb:
tusb-dma can't be built-in if tusb is not").

And while at it, let's not allow selecting the glue layers except
on platforms really using them unless COMPILE_TEST is specified:

- TUSB6010 is in practise only used on omaps

- DSPS is only used on TI platforms

- UX500 is only used on STE platforms

Cc: Linus Walleij <linus.walleij@linaro.org>
Reported-by: Jim Davis <jim.epost@gmail.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
This commit is contained in:
Tony Lindgren 2014-12-01 11:10:15 -08:00 committed by Felipe Balbi
parent 4fde6204df
commit c044247965
1 changed files with 4 additions and 0 deletions
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4
drivers/usb/musb/Kconfig
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@ -72,6 +72,8 @@ config USB_MUSB_DA8XX
config USB_MUSB_TUSB6010
tristate "TUSB6010"
depends on ARCH_OMAP2PLUS || COMPILE_TEST
depends on NOP_USB_XCEIV = USB_MUSB_HDRC # both built-in or both modules
config USB_MUSB_OMAP2PLUS
tristate "OMAP2430 and onwards"
@ -85,6 +87,7 @@ config USB_MUSB_AM35X
config USB_MUSB_DSPS
tristate "TI DSPS platforms"
select USB_MUSB_AM335X_CHILD
depends on ARCH_OMAP2PLUS || COMPILE_TEST
depends on OF_IRQ
config USB_MUSB_BLACKFIN
@ -93,6 +96,7 @@ config USB_MUSB_BLACKFIN
config USB_MUSB_UX500
tristate "Ux500 platforms"
depends on ARCH_U8500 || COMPILE_TEST
config USB_MUSB_JZ4740
tristate "JZ4740"